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ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 18 NO. 1
DEPARTMENTS
ABOUT THE COVER
“Shock and Awe.” Optical image of an actuator coil wire that
had fractured during aging and curing of the encapsulating
epoxy. The features observed were secondary shock cracks
in the cured epoxy when the wire fractured. Photo by
Michael Woo, Raytheon Failure Analysis Lab, First Place
Winner in Color Images, 2015 EDFAS Photo Contest.
Author Guidelines
Author guidelines and a sample article are available at
. Potential authors should consult the guidelines for
useful information prior to manuscript preparation.
A RESOURCE FOR TECHNICAL INFORMATION AND INDUSTRY DEVELOPMENTS
FEBRUARY 2016 | VOLUME 18 | ISSUE 1
ELECTRONIC DEVICE
FAILURE ANALYSIS
Bill Vanderlinde
Jeremy Walraven
Rose Ring
ChristianBoit andPhilippScholz
Mike Bruce
Larry Wagner
Rose Ring
For the digital edition, log in to , click on the "News/Magazines" tab, and select "EDFA Magazine."
Yann Weber
This paper presents case studies of silicon pipeline
defects and dislocations found on mixed-mode
technology.
Mototaka Ito and Jun Kato
Three-dimensional analysis techniques can be used to
detect entrapped filler as well as voids in copper pillar
bump joints.
Lee Levine
This article explores wire bonding’s continued growth
as the leading semiconductor interconnection method.
Surendra Madala
Read about new applications of the PFIB in delayering/
deprocessing and site-specific failure analysis.
A recap of the ISTFA 2015 event includes General Chair
James Demarest’s wrap-up as well as a list of the ISTFA
Best and Outstanding Papers and Posters. A summary of
the Panel Discussion and highlights from the four User
Groups can be found starting on