52 / 62
edfas.org
ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 18 NO. 1
52
Accelerated Analysis...................................................... 52
Allied High Tech........................................................ 26-27
ASM International.......................................................... 41
Checkpoint................................................................ 36-37
DCG................................................................................. 45
Digit Concept. ................................................................ 51
Hamamatsu. .................................................................... 3
IR Labs............................................................................ 21
JEOL. .............................................................................. 13
Oxford Instruments............................ Outside back cover
Quantum Focus Instruments........................................ 29
Semicaps........................................................................ 17
SPI Supplies................................................................... 47
Ultra Tec..................................... Inside front/back covers
For advertising information and rates
, contact: Kelly Thomas,
CEM.CMP, National Account Manager; tel: 440.338.1733;
fax: 614.948.3090; e-mail:
kelly.thomas@asminternational.org.
Current rate card may be viewed online
at
asminternational.org/mediakit.INDEX OF ADVERTISERS
A RESOURCE FOR TECHNICAL INFORMATION AND INDUSTRY DEVELOPMENTS
ELECTRONIC DEVICE
FAILURE ANALYSIS
Visit the Electronic Device Failure Analysis Society website
edfas.orgIRPS CONFERENCE
The IEEE International Reliability Physics Symposium’s (IRPS) annual conference will be
held
April 17 to 21, 2016,
at the Pasadena Convention Center in Pasadena, Calif.
The IRPS technical program includes technical sessions, keynote and invited talks on emerging issues, tutorials, work-
shops, an evening poster session, a year-in-review seminar, panel discussions, and equipment demonstrations. Special
attention is given to the reliability of advanced CMOS scaling, new materials introduction, new processes or integration
strategies, and/or fundamentally new device architectures. Attendees returning from the IRPS will be better equipped to
solve critical reliability problems and develop effective qualification procedures that affect their companies’ bottom line.
The IRPS Conference is sponsored by the IEEE Reliability Society and IEEE Electron Device Society. For more informa-
tion, visit the IRPS website at
irps.org.
NOTEWORTHY NEWS