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ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 18 NO. 1
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DIRECTORY OF
INDEPENDENT FA PROVIDERS
Rose Ring, Globalfoundries
CHINA ELECTRONIC COMPONENT CENTER
LABORATORY
Hi-Tech Industrial Park
Nanshan, Shenzhen, China
Tel: (0086)-755-86169156 or (0086)-755-86168847, ext. 805
e-mail:
Web:
Services: Electronic components testing and verification
services; counterfeit IC testing; incoming quality control;
system-/chip-level FA services; riskmitigation of electronic
components distribution; reselling; purchase and pro-
curement in industry supply chain; IC design, testing, and
verification services; wafer burn-in test for screening and
evaluation; testing data analysis; professional datasheet
translation (Chinese, English, Korean, Japanese, French);
skills training for quality-control staff; technical consulta-
tion and support; etc.
Tools/Techniques: SEM/EDX, x-ray fluoroscopic machine,
thermal shock test, ESD and latch-up tester, FIB circuit
edit, EMMI, OBIRCH, burn-in test, product life-cycle test,
solderability, decapsulation, deprocessing, chemical
decapsulation, microscopy, etc.
EVANS ANALYTICAL GROUP
MTE California—Santa Clara (one of several
international sites)
2710 Walsh Ave.
Santa Clara, CA 95051
Tel: 408.454.4600
Web:
Services: Materials characterization, microelectronics test
and engineering, analytical chemistry, environmental fate
andmetabolismservices, in-depthanalytical investigations
and litigation support, IC FA, ESD and latch-up testing, ATE
testing (parametric/functional), burn-in and reliability
qualifications, IC FIB circuit edit, PCBdesign and assembly,
advanced microscopy services, counterfeit IC FA, etc.
Tools/Techniques: Auger, AFM, EBSD, EDS, FTIR, GC-MS,
Electronic companies of all types and sizes require failure analysis (FA) services. The availability of indepen-
dent laboratories, contractors, and consultants to provide these services is critical as more and more elec-
tronic companies adopt the “fabless-to-labless” product engineering business model. The service providers are
needed as an outsourced capability for the “labless” companies, while other companies need services to add short-term
capacity to their lab, to complement in-house capabilities, or to overcome issues with equipment failures. The indepen-
dent FA service providers offer consulting, electrical testing, quality and reliability stress and testing, material, electrical,
and physical FA services. Our goal is to provide a resource of FA service providers for your reference files. The directory
lists independent providers serving various types of electronic companies and includes the address, contact information,
expertise, and types of technical services offered by each provider.
ICP-MS, Raman, RBS, SEM, SIMS, TEM/STEM, TOF-SIMS,
TXRF, XPS/ESCA, XRD, XRF, FIB/SEM cross sectioning, real-
time x-ray analysis, wet/dry chemical deprocessing and
sample preparation, XIVA, OBIRCH, LEM/EMMI, AFP, etc.
EXPONENTIAL BUSINESS TECHNOLOGIES COMPANY
Dr. Dehua Yang
7154 Shady Oak Rd.
Eden Prairie, MN 55344
Tel: 952.334.5486
e-mail:
Web:
Services: Nanoanalytical services, scientific instruments,
technical consulting, custom R&D, etc.
Tools/Techniques: Nanoindenter; nanoscratch, micro-
scratch, and microhardness testers; tribometers;
nanoparticle and solid-surface zeta potential analyzers;
nanopore size analyzer; contact/microcontact-angle
meters; surface/dynamic surface tensiometer; viscometer;
density meter; SEM/EDS; DSC; TGA; TMA; DMA; etc.
PEAKSOURCE ANALYTICAL, LLC
Dave Vallett
287 Buck Hollow Rd.
Fairfax, VT 05454
Tel: 802.999.8592​
​e-mail:
Web: ​
Services: Fault isolation using magnetic imaging; local-
ization of shorts, resistive opens, and complete opens in
packages, discretes, and PCBs; localization of shorts and
high- or low-resistance leakage paths in chips and wafers
from front or backside; static magnetic microscopy for
imaging field distributions from nonelectrical sources;
comprehensive training in FA and fault isolation
Tools/Techniques: IV characterization, SQUID-basedmag-
netic microscopy, GMR magnetic microscopy, visible and
near-infrared optical microscopy