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ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 18 NO. 1
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2. F. Carson: “Copper Wire Interconnect Has Arrived,” Chip Scale Rev.,
Jan./Feb. 2011, pp. 35-37.
3. S. Hunter, R. Gohnert, R.L. Warnick, and A.J. Dutson: “A Bond Pad’s
View of Wire Bonding,” IMAPS Wirebonding Workshop, Jan. 2013
(San Jose, CA)
ABOUT THE AUTHOR
Lee Levine’s previous experience includes 20 years as Principal and Staff Metallurgical Process
Engineer at Kulicke & Soffa Industries Inc. and Distinguished Member of the Technical Staff at Agere
Systems. Currently he runs his own business, Process Solutions Consulting, Inc., where he consults on
packaging reliability, wirebonding, andprovides scanningelectronmicroscopy/energy-dispersive spec-
troscopy andmetallography services. He has been awarded four patents and has publishedmore than
70 technical papers. His awards include both the 1999 John A. Wagnon Technical Achievement award
and the 2012 Daniel Hughes award for technical achievements fromthe International Microelectronics
Assembly and Packaging Society (IMAPS). Major innovations include copper ball bonding, loop shapes
for thin, small outline packages (thin-shrink small outline packages and chip-scale packages), and
introduction of design of experiments and statistical techniques for understanding assembly processes. He is an IMAPS
Fellow and a senior member of IEEE. Lee previously was IMAPS Vice President of Technology.
WIRE BONDING (continued from page 25)
EDFAS BOARD OF DIRECTORS
EDFAS is soliciting nominations for candidates for the EDFAS Board of Directors. Nominations are formember-at-large
Board positions for four-year terms beginning September 1, 2016, through August 31, 2020. There are expected to be
up to five positions open for nomination, and any members of EDFAS in good standing are encouraged to nominate
themselves or another member for one of these positions. The incumbents may also seek re-election by notifying the
Nominations Chair, Jeremy Walraven ).
Nominations are due March 1, 2016. Candidates who initiate or accept nomination will be asked to provide a three-
page nomination package that includes the candidate’s:
• Academic/business biography • Failure analysis background
• EDFAS and ISTFA involvement • Vision for the future of EDFAS
• Photograph and contact information
Nomination packages should be sent to Joanne Miller at 9639 Kinsman Rd., Materials Park, OH 44073-0002 or
. For more information or questions, call 440.338.5151, ext. 5513.
These nominations will be posted on the EDFAS website and published in the May issue of EDFA magazine. Voting will
be electronic and open to all EDFAS members. Voting will take place in June 2016, with the winners invited to join the
Board for the September 2016 teleconference.
Service on the EDFAS Board of Directors involves planning and driving the future strategy of your society. The Board
of Directors meets between quarterly and monthly by conference call, and face-to-face meetings at least once a year at
ISTFA. Boardmembers also provide liaison support to the several EDFAS committees, whichmay involve a few additional
conference calls.
Candidates are encouraged to ensure that they have the support of their employer for this activity.
2016 ELECTION –CALL FOR NOMINATIONS
Jeremy Walraven, Chair, EDFAS Nominating Committee
Past President, EDFAS