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ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 18 NO. 2
DEPARTMENTS
David Burgess
Stress voiding is an old but relevant failure to today’s
advanced metal systems with their reduced dimensions
and multiple metal layers. Read about the clues to diag-
nosing a stress void mechanism.
ABOUT THE COVER
Interior of a quartz tube, after repeated exposure to a
plasma, revealed spikes and bulbous spires. These for-
mations would break off and contribute to wafer surface
defectivity. Photo by Noel Forrette, IM Flash Technologies,
LLC, First PlaceWinner in Black &White Images, 2015 EDFAS
Photo Contest.
Author Guidelines
Author guidelines and a sample article are available at
. Potential authors should consult the guidelines
for useful information prior to manuscript preparation.
A RESOURCE FOR TECHNICAL INFORMATION AND INDUSTRY DEVELOPMENTS
MAY 2016 | VOLUME 18 | ISSUE 2
ELECTRONIC DEVICE
FAILURE ANALYSIS
JeremyWalraven
Rose Ring
Jason Higgins
hilippe Perdu
ike Bruce
Bill Ross
Larry Wagner
Rose Ring
Anthony S. Oates and Yi-Pin Fang
FinFET transistors will replace conventional planar geom-
etry for technology scaling beyond 20 nm. This article
presents experimental details, scaling trends, and simu-
lations of mechanisms responsible for soft errors in this
highly reliable architecture.
For the digital edition, log in to , click on the "News/Magazines" tab, and select "EDFA Magazine."
Kirk A. Martin and Nancy Weavers
Machines used for mechanical sample preparation have
limitations that can affect the results of the sample-prep
process. The information in this article is critical to the
industry, especially for those in package-level FA who are
qualifying new machines.