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ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 18 NO. 2
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DIRECTORY OF
INDEPENDENT FA PROVIDERS
Rose Ring, Globalfoundries
FRAUNHOFER CAM
Prof. Dr. Matthias Petzold
Walter-Huelse-Str. 1
06120 Halle (Saale), Germany
Tel: +49 345 5589-130
e-mail:
Web:
Services: Diagnostics of semiconductor technologies,
nanomaterials and nanoanalytics, microsystems char-
acterization, electronic systems integration assessments,
etc.
Tools/Techniques: Nondestructive defect localization,
target sample-preparation techniques, FIB techniques and
electronmicroscopy, surfaceand traceanalyses, AFM, XPS,
AES, TOF-SIMS, ICP-MS, crystallography and optical spec-
trometry, XRD, EBSD, FTIR, micro-Raman spectroscopy,
surface topography and deformation, polymer charac-
terization, DSC, DMA, TGA, TMA, corrosion testing, etc.
FUJITSU QUALITY LABORATORY, LTD.
4-1-1, Kamikodanaka, Nakahara-ku
Kawasaki-shi, Kanagawa
211-8588, Japan
e-mail:
Web:
Services: FA, component reliability evaluation, consult-
ing for research and development support, preventive
measures, supplier audit, materials analysis, reliability
and environmental tests, educational support, software
development, process improvement, supplier manage-
ment, quality consulting, etc.
Tools/Techniques: Test equipment;measurement/micro-
section techniques; pressure cooker, gas, weathering,
moisture resistance, temperature cycle, thermal shock,
solderability, vibration, migration (insulation), and damp
heat biased tests; HAST; emission microscope; whisker
evaluation; SEM-EDX; SAM; plastic package decapsula-
tion; etc.
MATERIALS ANALYSIS TECHNOLOGY INC.
Jubei Lab, Tai-Yuan Science Park, Failure Analysis
1F, No. 26-2, Tai-Yuan St.
Jubei City, Hsinchu County
Taiwan 302 R.O.C.
Tel: 886 3 6116678
Electronic companies of all types and sizes require failure analysis (FA) services. Our goal is to supply a resource of FA
service providers for your reference files. The directory lists independent providers and their contact information,
expertise, and types of technical services offered.
e-mail: or
Web:
Services: Physical and electrical FA; materials, surface,
andbenchmarkanalyses; packaging; bonding; ESD testing
and design; reliability testing; FIB analysis; project ser-
vices; tool sales; etc.
Tools/Techniques: Chemical (wet/dry) and laser decap-
sulation, parallel polishing, I-V measurements, OBIRCH,
EMMI, FIB, OM, real-time x-ray imaging, CSAM, TEM/STEM,
SEM, CAFM, SIMS, XPS/ESCA, XRD, AES, etc.
NANIUM RELIABILITY AND FAILURE ANALYSIS
Avenida Primeiro de Maio 801
4485-629 Vila do Conde, Portugal
Tel: +351 252 246 000
e-mail:
Web:
Services: Reliability testing; failure, electrical failure, and
physical failure analyses; reliability assessment; material
characterization; etc.
Tools/Techniques: Impedancemeasurementswithmicro-
probing capabilities, TDR, elementary chemical analysis,
electronmicroscopy, metallographic sample preparation,
dry/wet etch sample delayering, high-resolution imaging,
image analysis, manipulation and measuring software,
materials characterization (DMA, TMA, DSC), thermal
stress, temperature cycling on board and drop testing,
electrical stress with real-time impedancemeasurement,
lifetime expectancy with advanced statistical software,
etc.
NANOLAB TECHNOLOGIES INC.
1708 McCarthy Blvd.
Milpitas, CA 95035
Tel: 408.433.3320
e-mail:
Web:
Services: Microscopy and imaging, materials character-
ization (chemical and physical), EFA, PFA, PCB analysis,
FA bundled services (Level I, II Plus), FIB circuit edit, IC
deprocessing, sample preparation, consulting, managed/
partner labs, etc.
Tools/Techniques: 2-D/3-D x-ray imaging/tomogra-
phy, C-SAM, chemical/laser decapsulation, argon ion
and diamond milling, dimpling, wet/dry chemical IC