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ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 18 NO. 2 deprocessing, parallel mechanical polishing, FIB/SEM
cross sectioning/imaging, OM, LCM, TEM, UHR-SEM, ana-
lytical TEM, EELS, EDS, STEM, SIMS, ESCA/XPS, EMMI, FMI,
LSM-near IR, SOM (backside), TDR, FIB circuit edit (back/
topside) with Ga/plasma beam, AFM, AES, FTIR, GC-MS,
ICP-MS, Raman spectroscopy, XRD, XRR, WD-XRF, etc.
PRIORITY LABS
1001 S. Sherman St.
Richardson, TX 75081
Tel: 972.499.4756
e-mail:
Web:
Services: IC FA, materials analysis, counterfeit detection,
etc.
Tools/Techniques: Deprocessing, decapsulation, TDR,
electrical characterization, dye and pry, cross section-
ing, SAM, optical inspection, x-ray, global isolation, SEM,
FIB, etc.
SAGE ANALYTICAL LAB, LLC
Moe Homayounieh
6370 Nancy Ridge Dr., Suite 112
San Diego, CA 92121
Tel: 858.255.8587 or 949.338.2876
e-mail:
Web:
Services: PCB/package integrity evaluation and FA, IC
circuit edit, FIB nanofabrication, electronic component
DPA, competitor analysis/reverse engineering, compre-
hensive passive component FA, ESD/LU testing (HBM,
MM, CDM), IC process consultation, quality control/evalu-
ations, etc.
Tools/Techniques: 3-D/CT submicron x-ray, CSAM evalu-
ation, precise submicron cross sectioning and substrate
thinning/polishing, SEManalysis and imaging, EDS analy-
sis, front and backside FIB, dye and pry, photoemission
microscopy, LIVA, XIVA, OBIRCH, chemical/mechanical
decapsulation, electrical characterization/microprobing,
solder joint integrity, high-resolution IC/package photo­
navigation, chemical/mechanical deprocessing, etc.
SCIENTIA SILICON LTD.
Bank House
81 St. Jude’s Rd.
Englefield Green
Surrey, TW20 0DF, U.K.
Tel: +44 (0) 7717 841 115
e-mail:
Web:
Services: Client-focused solutions for physical FA, con-
structional analyses, counterfeit device investigation,
expert witness and consultation, semiconductor forensic
recovery and repackaging
Tools/Techniques: Precision mechanical polishing/
grinding (front andbackside, cross section), SEM/EDX, FIB,
CT, light microscopy, wire bonding
ITC 2016
The International Test Conference (ITC) will be held November 15 to 17, 2016, at the
Fort Worth Convention Center in Fort Worth, Texas. ITC is the world’s premier conference
dedicated to the electronic test of devices, boards, and systems and covers the complete
cycle from design verification and validation, test, diagnosis, failure analysis, and back to process, yield, reliability, and
design improvement. At ITC, test and design professionals can confront the challenges the industry faces and learn how
these challenges are being addressed by the combined efforts of academia, design tool and equipment suppliers, design-
ers, and test engineers.
ITC, the cornerstone of TestWeek events, offers a wide variety of technical activities targeted at test and design
theoreticians and practitioners, including formal paper sessions, tutorials, panel sessions, case studies, a lecture series,
commercial exhibits and presentations, and a host of ancillary professional meetings.
ITC is sponsored by the IEEE. For more information, visit .
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