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ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 18 NO. 2 • Z. Qui, R.S. Wilson, Y. Liu, et al.: “Translation
Microscopy (TRAM) for Super-Resolution Imaging,”
Sci. Rep., 2016, 6, p. 19993.
• S. Roy, K. Ushakova, Q. van den Berg, et al.: “Radially
Polarized Light for Detection and Nanolocalization
of Dielectric Particles [and Defects] on a Planar
Substrate,” Phys. Rev. Lett., 2015, 114, p. 103903. See
also “Synopsis: Light Finds Tiny Defects,” Physics,
March 12, 2015,
• M. Rutkauskas, C. Farrell, C. Dorrer, et al.: “High-
Resolution Subsurface Microscopy of CMOS
Integrated Circuits Using Radially Polarized Light,”
Opt. Lett., 2015, 40, p. 5502.
• S. Segawa, Y. Kozawa, and S. Sato: “Resolution
EnhancementofConfocalMicroscopybySubtraction
Method with Vector Beams,” Opt. Lett., 2014, 39, p.
3118.
• S. Segawa, Y. Kozawa, and S. Sato:“Demonstration of
Subtraction Imaging in Confocal Microscopy with
Vector Beams,” Opt. Lett., 2014, 39, p. 4529.
• C. Wu, S. Yao, andB. Corinne:“Leakage Current Study
and Relevant Defect Localization in Integrated
Circuit Failure Analysis [Using Photon Emission and
OBIRCH],” Microelectron. Reliab., 2015, 55, p. 463.
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GUEST EDITORIAL (CONTINUED FROM PAGE 2)
or a purely functional fault inside a system-in-package?
The right tool has not yet been built. Acoustic and x-ray
tomography are still evolving to provide incredible and
accurate resolution, but it may not be enough when the
defect must first be localized to reduce the area to inves-
tigate with other tools.
We are facing analyses on complex, small systems that
have embeddedwireless, self-power, various sensors, and
actuators. There is not yet a combination of multiphysics
tools to locate where the defect is, because the system
is often built in a sequential manner: sensor, processing,
wireless transmission/actuator. Built-in self-test could
help a lot if it integrates the multiphysics—not only elec-
trical—aspects of these devices, but it won’t fully replace
FA tools and techniques. It will be even worse with the
expected development of the Internet of Things.
Last, but not least, nanoelectronics are everywhere.
They are a big success story with some side effects for FA.
Small- andmedium-sized companies are developing new
products with an incredible diversity in the technologies
used. Remote health monitors, mobile applications,
wearable electronics, organic electronics, and plenty
of other new fields are included. Unfortunately, each
market is too small and not necessarily well identified to
encourage tool manufacturers to develop adapted tools
for these markets.
It is the right time for the electronics industry to
understand that the FA supply chain is fragile and needs
common efforts todevelop the right tools and techniques.
It is the right time for tool manufacturers to address
these new needs and to adapt and customize their tools
or develop new ones.
It is the right time for experienced failure analysts to
actively participate in the FA tool paradigm shift. EDFAS
will play a key role in cross fertilizing the global efforts of
all interested FA engineers.
REFERENCE
1. C.E. McCants: “An IARPA Success Story—The Circuit Analysis Tools
Program,” Electron. Dev. Fail. Anal., Aug. 2015,17 (3), pp. 50-52.