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47

ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 18 NO. 2

Contact Information

ANADEF 2016

Tel: 09 71 40 72 74

Web:

anadef.org

ASMC 2016

Margaret Kindling

Tel: 202.393.5552

e-mail:

mkindling@semi.org

Web:

semi.org/en/asmc2016

ASM International

Tel: 800.336.5152, ext. 0

e-mail:

MemberServiceCenter@asminternational.org

Web:

asminternational.org

IMEC

Tel: +32 16 28 12 11

e-mail:

info@imec.be

Web:

itf2016.be

Lehigh Microscopy School

Sharon Coe

Tel: 610.758.5133

e-mail:

slc6@lehigh.edu

Web:

lehigh.edu/microscopy

McCrone Group

Tel: 630.887.7100

Web:

mccrone.com

Semitracks, Inc.

Tel: 505.858.0454

e-mail:

info@semitracks.com

Web:

semitracks.com

MICROSCOPY &MICROANALYSIS 2016 MEETING

The Microscopy & Microanalysis (M&M) 2016 meeting will be held

July 24 to 28, 2016

, at the Columbus Convention

Center in Columbus, Ohio. The Scientific Program features the latest advances in the biological and physical sciences as

well as techniques and instrumentation. Complementing the program is one of the largest exhibitions of microscopy and

microanalysis instrumentation and resources in the world. Educational opportunities include a variety of Sunday short

courses, tutorials, evening vendor tutorials, pre-meeting workshops, and in-week intensive workshops. The opening

reception offers an opportunity to meet new people in the field and renew old acquaintances, and the Monday morning

Plenary Session features showcase talks from outstanding researchers as well as recognition of the major Society and

Meeting awardwinners. Therewill be other important awards conferred during themeeting, including daily poster awards

to highlight the best student posters in instrumentation and techniques as well as biological and physical applications

of microscopy and microanalysis.

M&M is sponsored by the Microscopy Society of America and the Microanalysis Society. For more information, visit

microscopy.org

or

microbeamanalysis.org

.

NOTEWORTHY NEWS

IPFA 2016

The 23rd International Symposium on the Physical and Failure Analysis of Integrated

Circuits (IPFA 2016) will be held

July 18 to 21, 2016

, at Marina Bay Sands, Singapore. The

event will be devoted to the fundamental understanding of the physical mechanisms of

semiconductor device failures as well as issues related to semiconductor device reliability and yield, especially those

related to advanced process technologies.

IPFA 2016 is organized by the IEEE Reliability/CPMT/EDSingapore Chapter. The Symposium is technically co-sponsored

by the IEEE Electron Device Society and IEEE Reliability Society.

For more information, visit the IPFA website at

ieee-ipfa.org/2016/.

NOTEWORTHY NEWS