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ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 18 NO. 4
DEPARTMENTS
43 SPECIAL! ISTFA 2016 SHOW LISTING Superconducting Single-Photon Detector Enables Time-Resolved Emission Testing of Low-Voltage Scaled ICsAndrea Bahgat Shehata, Franco Stellari, and Peilin Song
Time-resolvedoptical probing techniques remain an indis-
pensable tool for increasing fault localization speed and
accuracy. Read about the use of a novel photon detector
for low-voltage applications.
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4 16A RESOURCE FOR TECHNICAL INFORMATION AND INDUSTRY
DEVELOPMENTS
NOVEMBER 2016
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VOLUME 18
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ISSUE 4
edfas.org
ELECTRONIC DEVICE
FAILURE ANALYSIS
64 ADVERTISERS’ INDEX 44 BOD ELECTION RESULTS Jeremy Walraven 41 CALL FOR PAPERS 60 DIRECTORY OF FA PROVIDERS Rose Ring 62 GUEST COLUMNIST Christopher Henderson 2 GUEST EDITORIAL P.A.W. van der Heide 58 LITERATURE REVIEW Mike Bruce 48 PRODUCT NEWS Larry Wagner 54 TRAINING CALENDAR Rose Ring 56 UNIVERSITY HIGHLIGHT Mike Bruce 3-D Technology: Failure Analysis Challenges Ingrid De WolfChip-level 3-D integrationpromises performance and func-
tionality improvements in microelectronics systems, but
what are the additional challenges for the failure analysis
community?
24For the digital edition, log in to edfas.org,
click on the "News/Magazines" tab, and
select "EDFA Magazine."
LVI and LVP Applications in In-Line Scan Chain Failure AnalysisZhigang Song and Laura Safran
This article discusses the combination of laser voltage
imaging and laser voltage probing to improve the failure
analysis success rate for in-line scan chain logic macro
diagnosis.
Emerging Techniques for 2-D/2.5-D/3-D Package Failure Analysis: EOTPR, 3-D X-Ray, and Plasma FIBChristian Schmidt, Jesse Alton, Martin Igarashi, Lisa Chan,
and Edward Principe
This article discusses emerging FA trends for package
products using three techniques as the next-generation of
FAmethods tomeet specific needs. Case studies highlight
the benefits of the techniques and discuss obstacles and
future improvements.
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