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ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 18 NO. 4
48
PRODUCT NEWS
Larry Wagner, LWSN Consulting Inc.
PRESS RELEASE SUBMISSIONS:
PARK SYSTEMS LAUNCHES RESEARCH
AFM
Park Systems (Suwon, Korea) launched Park NX20
300 mm, the first and only research atomic force micro-
scope (AFM) on themarket capable of scanning the entire
sample area of 300 mm wafers using a 300 mm vacuum
chuck while keeping the system noise level below 0.5 Å
root mean square.
The Park NX20 300 mm system is run by SmartScan,
Park’s new operating software with automatic scan
control, and it comes with “batch mode” functionality,
where the users can perform a recipe-automated, unlim-
ited number of sequential multiple-site measurements
over the 300 × 300 mm area. The automated measure-
ments over a 300 mm wafer dramatically improve user
convenience and productivity in the industrial lab setting,
where comparisons within site-to-site and sample-to-
sample surface morphologies (height, surface roughness
measurements) are extremely important.
“Today, large samples of up to 300mmwafers and sub-
strates are widely used for process development, failure
analysis, and production, but so far there has not been an
AFM measurement tool that can accurately measure the
full area in one load and easily program it to takemultiple-
sitemeasurements in one click,” commentedKeibock Lee,
Park Systems’ President. “ParkNX20 300mmaccesses the
entire 300 mm wafer in a single loading with low-noise
AFM measurements, which opens up a whole new scope
of measurement automation on a 300 mm wafer.”
Park NX20 300 mm enables AFM inspection and scans
over the entire sample area of 300 mm wafers by using
a full 300 × 300 mm motorized XY stage, so the system
can access any location on a 300 mm wafer. Unlike other
products currently on the market, Park’s NX20 300 mm
is the only product that can hold a 300 mm sample. For
example, the competitor’s system that comes closest
to Park’s is combined with a 300 mm sample chuck but
requires the user to load nine times to access the entire
300 mm wafer area, because the range of the motorized
XY stage is limited to 180 × 220 mm.
ParkNX20 300mmstandard vacuumchuck is designed
to hold samples ranging in size from 300 to 100 mm and
can even support small coupon samples of arbitrary
shapes, using a vacuum hole. Products currently on the
market are limited to 200 mm sample sizes and must
rely on cutting up the sample to maintain the low noise
required by industry, which is cumbersome and makes
sharing the AFM a challenge. The new Park NX20 is the
perfect solution for shared labs whose samples come in
various sizes—small and large—because it supports from
large to small coupon samples and is compatible with all
the modes and options available to Park’s other research
AFM products.
For more information: web: parkafm.com; tel:
408.986.1110.
TERAVIEW INTRODUCES IC PACKAGE-
INSPECTION SYSTEM
TeraView (San Francisco, Calif.), the pioneer and
leader in terahertz technology and solutions, introduced
the EOTPR 5000, a fully automated integrated circuit (IC)
package-inspection system. Building on the success of the
EOTPR 2000, which has an established track record in the
industry for rapid fault isolation and manual inspection,
the EOTPR 5000 is a fully automated advanced IC pack-
age-inspection system that uses TeraView’s proprietary
electro-optical terahertz pulse reflectometry (EOTPR)
technology to detect weak or marginal interconnect
quality in high-volume manufacturing environments,
whichno other technology can currently detect.
Today’s advanced IC packages are susceptible to a
variety of faults and quality variations, including solder
ball defects such as head-in-pillow failures in package-
on-package or 2.5-/3-Dpackages. Theseweak ormarginal
interconnect conditions may not be captured by logic or
electrical testers even if there is good electrical continuity
present. However, due to the EOTPR 5000’s superior accu-
racy and sensitivity, users can nowdetect minute shifts in
impedance changes fromweak ormarginal interconnects
after accelerated life tests or high-temperature cycle tests.
The same principle applies to the detection and reduction
ofmanufacturing variations to improve packaging-related
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