LVI AND LVP APPLICATIONS IN IN-LINE
SCAN CHAIN FAILURE ANALYSIS
3-D TECHNOLOGY: FAILURE ANALYSIS
EMERGING TECHNIQUES FOR 2-D/2.5-D/
3-D PACKAGE FAILURE ANALYSIS: EOTPR,
3-D X-RAY, AND PLASMA FIB
SUPERCONDUCTING SINGLE-PHOTON
DETECTOR ENABLES TIME-RESOLVED
EMISSION TESTING OF LOW-VOLTAGE
SCALED ICs
A RESOURCE FOR TECHNICAL INFORMATION AND INDUSTRY DEVELOPMENTS
NOVEMBER 2016
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VOLUME 18
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ISSUE 4
edfas.org
ELECTRONIC DEVICE
FAILURE ANALYSIS
2015WINNERS
a
b
d
e
f
c