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ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 18 NO. 4
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Accelerated Analysis...................................................... 64 Allied High Tech................................................. 32-33 / 42 Applied Beams............................................................... 55 ASM International.......................................................... 41 Checkpoint......................................................... 42 / 46-47 Hamamatsu. .................................................................... 3 IR Labs............................................................................ 15 JEOL. ................................................................................ 9 Mentor Graphics...................................................... 35 / 42 Nisene Technology Group............................................. 53 Oxford Instruments............................ Outside back cover Quantum Focus Instruments................................. 11 / 49 Quartz Imaging....................................................... 42 / 51 Sela USA, Inc.................................................................. 63 Semicaps........................................................................ 21 SPI Supplies................................................................... 23 ULTRA TEC........................... 42 / Inside front/back covers XEI Scientific. ................................................................. 39 Zurich Instruments.......................................................... 7For advertising information and rates
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ELECTRONIC DEVICE
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ABOUT THE AUTHOR
Christopher Henderson
received his B.S. degree in physics from the New Mexico Institute of
Mining and Technology and his M.S.E.E. from the University of New Mexico. He is the President and
one of the founders of Semitracks Inc., a U.S.-based company that provides education and training
to the semiconductor industry. Chris also teaches courses in failure analysis, reliability, and semicon-
ductor technology for the semiconductor industry. From 1988 to 2004, he worked at Sandia National
Laboratories, where hewas aPrincipal Member of the Technical Staff in the Failure Analysis Department
and theMicrosystems Partnerships Department. His job responsibilities have included reliability, failure
and yield analysis of components fabricated at Sandia’s Microelectronics Development Laboratory,
research into the electrical behavior of defects, and consulting onmicroelectronics issues for the Department of Defense.
He was the General Chair of ISTFA 2007 and IRPS 2016. Chris has published more than 25 papers at various conferences
in semiconductor processing, reliability, failure analysis, and test. He has received two R&D 100 Awards and two Best
Paper Awards. Prior to working at Sandia, Chris worked for Honeywell, BF Goodrich Aerospace, and Intel. Chris is a senior
member of IEEE and a member of the EDFAS and IRPS Boards of Directors.
analyzing a wider variety of components. This means you
need a broader knowledge base. Rather than knowing a
single wafer fab process, you may need to know several,
or even several dozen. Rather than knowing about one
particular package type, you may need to know several,
or even several dozen. The fundamentals will still matter,
so be sure to continue your learning to understand the
chip design process, how to test integrated circuits,
(continued from page 62)
TRAINING IN AN ERA OF INDUSTRY CONSOLIDATION AND AUTOMATION
reliability issues, failure mechanisms, packaging design
and materials, and how to tackle yield issues. As always,
we here at Semitracks Inc. stand ready to assist you in this
effort through in-person aswell as online training courses.
Electronics manufacturers highly covet the knowledge-
able failure analyst who can lead a team effort to rapidly
and effectively solve problems. Position yourself for one
of these roles.