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ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 18 NO. 4
coater, complete sample-preparation tools, eight-channel
dynamic analyzer, multichannel data logger, laser-sighted
infrared temperature gun,modally tuned impact hammer,
phototachometers, accelerometers, dynamic pressure
sensors, high-speed video camera, proximity probe ther-
mocouples and RTDs, coordinate-measuring machine
with laser scanner, strain gages and amplifiers, vibration,
dynamic and static pressure, thermographics, tempera-
ture displacement, strain measurements, etc.
MATERIALS EVALUATION AND ENGINEERING, INC.
13805 1st Ave. North, Suite 400
Plymouth, MN 55441
Tel: 763.449.8870 or 888.349.8870
Web: mee-inc.com
Services:
FA, corrosion evaluation, fracture analysis,
materials process andproduct evaluation, expert witness,
etc.
Tools/Techniques:
SEM; FESEM; EDS; broad-beam ion
milling; lightmicroscopy;microsectioning (precision cross
sections); metallography; corrosion, Rockwell hardness,
microhardness, and tension/compression testing; custom
test design; testing to industry standards; etc.
NATIONAL TECHNICAL SYSTEMS
24007 Ventura Blvd., Suite 200
Calabasas, CA 91302
Tel: 818.591.0776
Web: nts.com
Services:
Product FA; component electrical, product
safety, wireless/radio, and hardware/software testing;
materials, mechanical, and chemical testing; etc.
Tools/Techniques:
DSC, DMA, EDS, FTIR, ionchromatogra-
phy, CSAM, SEM, thermal conductivity, TGA, TMA, real-time
x-ray, XRF, AAS, GC/MS, ICP/OES, etc.
PREMIER SEMICONDUCTOR SERVICES
2330 W. University Dr.
Tempe, AZ 85281
Tel: 480.736.1970
e-mail:
info@PremierTest.comWeb: premiers2.com
Services:
Multiple-platform IC electrical testing, lead-free
and lead conversion, MIL-STD 883 burn-in, IC program-
ming, IC counterfeit detection, lead inspection and repair,
tape and reel services, bake and dry pack, etc.
Tools/Techniques:
Hot solder dip and restoration, sol-
derability, fine and gross leak test, mark and demark, IC
recovery from boards, advanced and investigative visual
inspection, decapsulation, electrical counterfeit testing,
board development test, limited electrical test, etc.
SAGE ANALYTICAL LAB, LLC
6370 Nancy Ridge Dr., Suite 112
San Diego, CA 92121
Tel: 858.255.8587
e-mail:
info@sagefalab.comWeb: sagefalab.com
Services:
ESD/latch-up testing, IC and package FA, back-
side IC editing, electrical characterization, microprobing,
etc.
Tools/Techniques:
High-pin-count parametric testing,
chemical/mechanical decapsulation and deprocessing,
ion milling/polishing/cutting, 3-D CT submicron x-ray
analysis, solder joint integrity, CSAM, IC process evalu-
ation/documentation, IR/XIVA/TIVA/OBIRCH analyses,
photon emission microscopy, temperature mapping,
RIE passivation/dielectric removal, precise submicron
cross sectioning and substrate thinning/polishing, SEM
analysis and imaging, EDS/EDAX analysis, FIB IC circuit
modification, SEM/FIB nanofabrication, electronic com-
ponent DPA, dye and pry, Orion2 HD tester, RTI MegaTrace
System, JetEtch Pro-CuProtect System, Hitachi Model
IM4000 Milling System-OBE 0038, Omniprobe AutoProbe
200, Synopsys Camelot, Olympus low- and high-magnifi-
cation optical microscopy, Multi-ProbeMP1 Nanoprobing
System, parametric analyzers, probe stations, TDR, etc.
2017 IRPS CONFERENCE
The IEEE International Reliability Physics Symposium’s (IRPS) annual conference will be
held
April 2 to 6, 2017,
at the Hyatt Regency in Monterey, Calif.
The deadline for submission of paper and poster abstracts is October 15, 2016. IRPS 2017 is soliciting increased par-
ticipation in the following areas: system reliability; middle-of-the-line; extrinsic defect impact on yield and reliability; and
commercial off-the-shelf components in high-reliability applications, including screening, derating, case studies, design
considerations, and so on.
The IRPS Conference is sponsored by the IEEE Reliability Society and IEEE Electron Device Society. For more informa-
tion, visit the IRPS website at irps.org.
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