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at Fully Packaged and Stacked Die Devices Using Lock-In
Thermography,” 17th IEEE Int. Symp. Phys. Fail. Anal. Integr. Circuits
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5. C. Schmidt et al.: “Lock-in-Thermography for 3-Dimensional
Localization of Electrical Defects Inside Complex PackagedDevices,”
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Optical Terahertz Pulse Reflectometry,” Proc. 19th Int. Symp. Phys.
Fail. Anal. Integr. Circuits (IPFA), July 2-6, 2012 (Singapore).
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Optical Terahertz Pulse Reflectometry (EOTPR) for 2D and 2.5D
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Reflectometry—A Fast and Highly Accurate Non-Destructive Fault
Isolation Technique for 3D Flip Chip Packages,” Proc. 39th Int. Symp.
Test. Fail. Anal. (ISTFA),Nov. 3-7, 2013 (San Jose, CA).
11. K.C. Lee, J. Alton, M. Igarashi, and S. Barbeau: “Feature Based Non-
Destructive Fault Isolation in Advanced IC Packages,” Proc. 40th
Int. Symp. Test. Fail. Anal. (ISTFA),Nov. 9-13, 2014 (Houston, TX),
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12. T. Hrnčíř, J.V. Oboňa, M. Petrenec, J. Michalička, and C. Lang: “How
Xe and Ga FIB Differ in Inducing Lateral Damage on TEM Samples,”
Proc. 38th Int. Symp. Test. Fail. Anal. (ISTFA),2015.
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14. F. Altmann, J. Beyersdorfer, J. Schischka, M. Krause, G. Franz, and L.
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Throughput Plasma-FIBMilling,”Proc. 38th Int. Symp. Test. Fail. Anal.
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15. T. Hrnčíř, J. Dluhoš, L. Hladík, E. Moyal, J. Teshima, and J. Kopeček:
“AdvancesinFIB-SEMAnalysisofTSVandSolderBumps—Approaching
Higher Precision, Throughput, and Comprehensiveness,”Proc. 40th
Int. Symp. Test. Fail. Anal. (ISTFA),2014.