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ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 18 NO. 4
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ABOUT THE AUTHORS
Christian Schmidt
received his Diploma (
Fachhochschule
) in physics technology and data
information fromtheUniversity of AppliedSciencesMerseburg andhis Ph.D. in engineering fromMartin
Luther University Halle-Wittenberg. Since 2007, he has been an active member of the semiconductor
FA industry, serving both as research fellow and FA engineer. Dr. Schmidt’s development of 3-D defect
localization using lock-in thermography has been widely published, leading to multiple patents and
international paper awards. In 2014, he joinedGlobalfoundries Fab 8 inMalta, N.Y., first as aMember of
the Technical Staff engineer before transitioning into the Senior Section Manager role for package FA.
Jesse Alton
received an M.S. degree in physics from the University of London, Royal Holloway.
He was employed at Pacific Northwest National Laboratory in Richland, Wash., where he undertook
studies into the vitrification of high-level nuclear waste. He returned to theU.K. to complete a Ph.D. at
the University of Cambridge, where he focused on the development of high-power terahertz sources
and their applications. Upon completing his Ph.D., Dr. Alton joined TeraView Ltd. in April 2005, where
he currently leads the Semiconductor Applications Group. He has authored or co-authored over 50
published papers.
Martin Igarashi
has over 25 years of experience in the roles of engineering,
applications engineering, sales and marketing, mergers and acquisitions, product development,
and general management of product divisions in the electronic design automation, plasma etch,
photolithography, test and measurement, and laser material processing industries. He has worked
for companies such as Electro Scientific Industries, Toppan, ETEC Systems, Applied Materials, and
Tektronix. Mr. Igarashi earned a Bachelor’s degree in applied mathematics from the University of
California, Santa Barbara. He currently heads TeraView’s semiconductor business and is based in
Portland, Ore.
Lisa Chan
received a Bachelor’s degree in chemical engineering and materials science and engi-
neering from the University of California Irvine and a Ph.D. inmaterials science and engineering from
CarnegieMellon University. While at CarnegieMellon, she researched the use of electron backscatter
diffraction to investigate the relationship between grain-boundary orientations and intergranular
corrosion cracking in aluminum alloys. Dr. Chan then analyzed grain-boundary distributions in
three-dimensional microstructures of nickel-based superalloys, with a thesis titled “Synthetic Three-
Dimensional Voxel-BasedMicrostructures that ContainAnnealing Twins.” In June 2013, Dr. Chan joined
Tescan as an applications specialist responsible for performing demos, hosting training classes,
and supporting customers. She is the main applications specialist for Tescan’s FERA and XEIA plasma FIB-SEMs, but her
expertise also extends to the LYRA and GAIA gallium FIB-SEMs and MIRA and VEGA microscopes. Dr. Chan has attended
conferences, hosted workshops, and trained customers all over Canada and the United States.
EdwardPrincipe
is the FIB-SEMand FE-SEMProduct Manager for North America for TescanUSA. Dr.
Principe hasmore than 19 years of industry experience in advancedmaterials characterization, includ-
ing FIB, FE-SEM, high-resolution TEM, ultrahigh-vacuumsurface analysismethods (x-ray photoelectron
spectroscopy, or XPS, and Auger), the design andmanufacture of imaging near-edge x-ray-absorption
fine structure (NEXAFS) hardware, and application of synchrotron-based methods (NEXAFS/XPS) for
generalmaterials research and the semiconductor industry. His previous employment includes Charles
Evans & Associates (XPS/Auger/synchrotron), Applied Materials (FIB-Auger, distribution of relaxation
time), Carl Zeiss NTS (Principal Scientist for North America), Founder/President of Synchrotron
Research Inc., and Tescan USA (North America Product Manager for FIB-SEM and FE-SEM). Dr. Principe has written two
textbook chapters on the application of FIB-Auger and FIB-based 3-D nanotomographic reconstruction, co-authored a
Microscopy Society of America Best Paper Award winner relating to TEM/STEM characterization on advance dielectrics,
and co-authored the recipient of an EDFAS Best Paper Award. He holds two patents in FIB-based 3-D reconstruction and
has recently focused on the application development of both time-of-flight FIB-SIMS and the recent introduction of the
Tescan RISE, the combination of electron and ion microscopy/spectroscopy with Raman optical spectroscopy.