42 / 66
edfa
s.
orgELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 18 NO. 4
42
Visit these key exhibitors and more at ISTFA ’16 in Halls
D-F of the Fort Worth Convention Center in Fort Worth,
Texas.
Exhibition dates and times*
Tuesday, November 8
Show hours: 9 a.m. – 6:40 p.m.
Networking reception: 5 – 6:40 p.m.
Wednesday, November 9
Show hours: 9:30 a.m. – 3:30 p.m.
Dessert reception: 1:30 – 3:30 p.m.
*Times are subject to change
EXHIBITORS
SHOWCASES
Checkpoint Technologies develops and manufactures innovative optical failure analysis tools used by semiconductor manufacturers to improve the speed and reliability of integrated circuits. Our prod- ucts, which range from OEM components to fully-integrated, end-user solutions, reflect our fundamental commitment to maximizing value by adapting technology to meet specific market needs. checkpointtechnologies.com CHECKPOINT TECHNOLOGIES, LLC ALLIED HIGH TECH PRODUCTS, INC. BOOTH 201 BOOTH 301 The Tessent Diagnosis software accelerates defect localization in digital semiconductor devices. With layout- aware and cell-aware technology, interconnect as well as cell-internal defects can be precisely identified based on manufacturing test fail data. Tessent SiliconInsight makes silicon diagnosis even more accessible, enabling bench-top test, characterization, and diagnosis of ATPG-, compression-, and BIST- tested circuits. mentor.com MENTOR GRAPHICS Software for a FASTER and SMARTER Lab! • FA-LIMS: The only laboratory information management system built specifically for failure analysis and materials characterization labs. Configured to match your specific work- flow and terminology requirements. Improve lab productivity and efficiency! • RE-LIMS: For reliability and quality assurance labs. Generate qual plans quickly, track all times and results, manage priorities and resources. Interfaces with FA-LIMS. • PCI-AM (Automated Measurement of Semiconductor Features) Version 4.0: This module for Quartz PCI pro- vides automated measurement features for engineers who measure different types of semiconductor device features. Automation for single images and multiple similar images. Saves valuable time! quartzimaging.com QUARTZ IMAGING CORPORATION BOOTH 306 BOOTH 121 ULTRA TEC INTRODUCES UPGRADED THERMAL STAGE ULTRA TEC is pleased to introduce a new upgraded thermal stage for its popular ASAP-1 IPS Digital Preparation System. The upgraded thermal module now offers both heating and cooling options for the sample stage, thus achieving optimum process conditions and improved silicon thinning and polishing results. In addition, the included chiller (dubbed "ULTRACHILL") offers overall system thermal-stability improvements. This makes ASAP-1 IPS the first commercially- available preparation system to offer true reproducible nanoscale results that meet the challenges of the latest analytical microscopy methods, with respect to ultrathinning, surface quality, and survivability, for a range of IC sample types. ultratecusa.com ULTRA TEC BOOTH 221ISTFA 2016
For over 33 years, Allied High Tech Products has provided quality products for metallographic sample preparation and analysis. Allied manufactures state-of-the-art equipment at its California headquarters, including sectioning machines, mounting systems, grinders/polishers, and a precision tabletop milling machine. All design, manufacturing, assembly, and testing takes place in-house to ensure the highest-quality equipment is produced. Allied is also a national Carl Zeiss Microscope dealer and carries a full line of hardness testers from Mitutoyo. Quality consumables and accessories are also available. Visit our website for more information, an online account for purchasing, or to download the current catalog. alliedhightech.com