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ON THE COVER:
Continuous wave-THz
spectroscopy system emitter and
detector devices for
semiconductor materials
characterization. Dome-shaped
emitters and detectors are
mounted on thermally stable,
optical stages that maintain THz
alignment while measurements
are taken at variable temperatures.
Courtesy of Lake Shore
Cryotronics Inc.,
lakeshore.com.
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Advanced Materials & Processes
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by ASM International, 9639 Kinsman Road, Materials Park, OH 44073-0002; tel: 440.338.5151; fax: 440.338.4634. Periodicals postage
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37 ASM News The monthly publication about ASM members, chapters, events, awards, conferences, affiliates, and other Society activities.Check out the
Digital Edition online at
amp.digitaledition. asminternational.orgADVANCED MATERIALS & PROCESSES •
OCTOBER 2014
1
17 20 23 25 32DEPARTMENTS
Resonant Ultrasound Spectroscopy Offers Unique Advantages as a Nondestructive Test Method Haoqi Li and Fei Ren Resonant ultrasound spectroscopy is making headway as a fast and nondestructive measurement technique. Thanks to advances in computer technology, codes and software are now available for data reduction, analysis, and interpretation. Nondestructive Variable Temperature Materials Characterization for Semiconductor Research Andy Phillips To meet the rigorous demands of next-generation computer technology, new approaches to nondestructive measurement for early stage, temperature dependent materials characterization are needed. TECHNICAL SPOTLIGHT Using Digital Image Correlation to Measure Full Field Strain Existing strain measurement techniques do not offer enough information about how failures occur, so alternative methods are needed. One technique involves using digital image correlation (DIC) to measure full field strain over the entire material surface. TECHNICAL SPOTLIGHT Nondestructive Acoustic Cross- Sectioning Helps Pinpoint Part Failures Physical cross-sectioning is commonly used on parts to reveal and study their internal features and defects. An alternative technology, acoustic cross-sectioning, produces equivalent results and images for small parts without damaging them. METALLURGY LANE Aluminum: The Light Metal—Part II Charles R. Simcoe The cost of electric power is the biggest expense involved in aluminum production. Proximity to economical power sources determined the location of major aluminum reduction plants.contents
28 ISTFA 2014 Show Preview This year’s technical program features 83 new and exciting presentations as well as poster displays, a panel discussion, and four user groups. Technical symposia, seminars, short courses, and an exposition make ISTFA the go-to failure analysis event for continuing education, networking, and furthering your career.