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ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 18 NO. 4

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ABOUT THE AUTHORS

AndreaBahgat Shehata

receivedhisB.S., M.S., andPh.D. degrees (summa cumlaude) inelectronics

engineering from the Politecnico di Milano, Milan, Italy, in 2007, 2009, and 2013, respectively. In 2013

he joined the IBMT.J. Watson Research Center, YorktownHeights, NY, as a postdoctoral researcher. His

current research interests include the development and characterization of new systems for testing

very-large-scale integration circuits based on static imaging and time-resolved emission. Dr. Bahgat

Shehataworkedwith low-jitter andhigh-quantum-efficiency SSPDs, pushing their limits toward record

low-voltage applications. He hasmore than 45 publications. In 2015, Dr. Bahgat Shehatawas awarded

the Paul F. Forman Team Engineering Excellence Award.

Franco Stellari

received M.S. and Ph.D. degrees in electronics engineering from the Politecnico

di Milano, Italy, in 1998 and 2002, respectively. He subsequently joined the IBMT.J. Watson Research

Center as a postdoctoral researcher, becoming a research staff member in 2004. His major interests

are the development and use of new optical methodologies for very-large-scale integration circuit

testing and hardware security. He has more than 85 international publications and more than 24

patents. Dr. Stellari has been the recipient of four Best Paper Awards and the Paul F. Forman Team

Engineering Excellence Award.

Peilin Song

is a Principal Research Staff Member at the IBM T.J. Watson Research Center, where

he manages the Circuit Diagnostics and Testing Technology Department. He joined IBM in 1997 and

has since worked in the area of design for testability, fault diagnostics, optical testing, and recently

hardware security and reliability. Dr. Song has more than 100 publications and holds more than 38

U.S. patents, with several patents pending. In 2004, he won the IEEE Electron Device Society Paul

Rappaport Award. Dr. Song is an IEEE Senior Member. He received his Ph.D. in electrical engineering

from the University of Rhode Island in 1997.

SUPERCONDUCTING SINGLE‑PHOTON DETECTOR

(continued from page 20)

ITC 2016

The International Test Conference (ITC) will be held

November 15 to 17, 2016

, at the

Fort Worth Convention Center in Fort Worth, Texas. ITC is the world’s premier conference

dedicated to the electronic test of devices, boards, and systems and covers the complete

cycle from design verification and validation, test, diagnosis, failure analysis, and back to process, yield, reliability, and

design improvement. At ITC, test and design professionals can confront the challenges the industry faces and learn how

these challenges are being addressed by the combined efforts of academia, design tool and equipment suppliers, design-

ers, and test engineers.

ITC, the cornerstone of TestWeek events, offers a wide variety of technical activities targeted at test and design

theoreticians and practitioners, including formal paper sessions, tutorials, panel sessions, case studies, a lecture series,

commercial exhibits and presentations, and a host of ancillary professional meetings.

ITC is sponsored by the IEEE. For more information, visit itctestweek.org.

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