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ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 18 NO. 3
DEPARTMENTS
Martin Keim
S.H. Goh, B.L. Yeoh, G.F. You, Y.H. Chan, Zhao Lin, Jeffrey
Lam, and C.M. Chua
This article details the fundamentals behind EeLADA, a
technology evolution in extracting relevant signals for
debugging soft and hard failures. ABOUT THE COVER
In situ solid immersion fabrication lenses createdby randomly
scattering polyethylene spheres across the backside of a die,
thenmelting the spheres to formmicroscopic etchmasks. The
samplewas plasma etched, and the plasticwas removed. The
sample was polished using colloidal silica. The lens shapes
formed naturally due to the dynamics of polishing. The photo
was taken using differential interference contrast. Photo by
Mark Kimball, Maxim Integrated Circuits. First Place Winner in
False Color Images, 2015 EDFAS Photo Contest.
Author Guidelines
Author guidelines and a sample article are available at edfas.
org. Potential authors should consult the guidelines for useful
information prior to manuscript preparation.
A RESOURCE FOR TECHNICAL INFORMATION AND INDUSTRY DEVELOPMENTS
AUGUST 2016 | VOLUME 18 | ISSUE 3 edfas.org
ELECTRONIC DEVICE
FAILURE ANALYSIS
Nebojša Janković and Frank Zachariasse
Yen-Kuang Chen
The Internet of Things concept is the “next big thing,” but
what are the obstacles to achieving that vision? Device
failure, sensitivity, scalability, middleware, and user inter-
action are challenges for this evolving technology.
For the digital edition, log in to edfas.org, click on the "News/Magazines" tab, and select "EDFA Magazine."
John Bescup
Passive components remain an integral part of today’s
circuit design. Read about the unlikely failure mode of a
high-voltage leaded-ceramic-chip capacitor for downhole
application.
F
symposium, which focused on aeronautic, space, and
embedded systems in 2015.