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ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 18 NO. 3

32

ISTFA 2016

ISTFA 2016 PREVIEW

Martin Keim, ISTFA 2016 General Chair

Mentor Graphics Corporation

Martin_Keim@Mentor.com

S

electing the theme of the symposium is one of the

great privileges of the General Chair. The theme

binds together the individual aspects of the sym-

posium, focuses the activities, and sets the overall tone

for the entireweek. Selecting the theme is also something

that can cause sleepless nights for the General Chair…

ACTING ON “THE NEXT-GENERATION”

THEME

“The Next Generation” is the theme I chose for the

42nd International Symposium for Testing and Failure

Analysis (ISTFA). It places up-front-and-center the “crisis”

we are facing. After I announced the theme at the EDFAS

General Meeting during ISTFA 2015, fellow engineers

came to me to passionately express their concern that

not enough newengineers are entering the field of failure

analysis, and those who are need lots of extra training.

Themost recent symposia began instituting programs

to counter this trend. For 2016, we are intensifying our

efforts to attract new engineers as well as offer oppor-

tunities for students to present their work and engage in

discussions with experts in the field. These interactions

benefit both sides tremendously. A student’smindmay be

placed on a path toward researching something extraor-

dinary, and you, the expert, may have met your future

new hire. The ISTFA Organizing Committee plans to offer

special prizes as a way of acknowledging contributions

from students.

Inpreparation for ISTFA’s Panel Discussionandkeynote

speaker, we dug deeper into what is “out there”—some-

thing that shows the failure analysis community working

solutions to the next-generation problem. We were suc-

cessful in finding several such examples. In his keynote

address, Prof. Dr.-Ing. Christian Boit from the Technische

Universität Berlin, former director of failure analysis at

Infineon Technology and General Chair of ISTFA 2002, will

make the case that it is possible for a university to equip

engineers with great skills and knowledge, ready to enter

theworkforce in the demanding failure analysisworld. His

students successfully find internships and employment at

tier-1 semiconductor companies not only in Europe but

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