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ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 18 NO. 3
use, together with the deployment of sensor networks
and robots
The other Monday morning tour was of the ITEC lab, a
well-equipped platform shared by CNES, Thales, Elemca,
and Intraspec Technologies. The tour was organized
around demo workshops at the heart of component
analysis:
• The FIB
• Sample preparation
• Electrical testing
• X-ray computed tomography
• Do you like MEMS?
• Light emission and laser tests
• Electron backscatter diffraction: microscopy for mate-
rial analysis
• Defect localization
• Microscopes
There were also industry tours on Friday afternoon,
including:
• TRADTests andRadiations, which provided a complete
tour of the entire radiation assurance chain: radiation
analysis, electronic components and material testing,
radiation software development, and training courses
• FreescaleDiscovery Lab, whichhas the goal of targeting
disruptive innovation, fromproject selection to proof-
of-concept development and innovation protection
A big thank you is extended to all the volunteers, to the
efficient and excellent LAAS team support, and to all the
participants and attendees who created this memorable
event.
Don’t miss the 27th European Symposium on Relia
bility of Electron Devices, Failure Physics and Analysis
(ESREF 2016), whichwill be heldSeptember 19 to 22, 2016,
in Halle (Saale), Germany. ESREF 2016 will have a specific
focus on reliability issues in automotive electronics.
Matthias Petzold (Fraunhofer Institute for Micro
structure of Materials and Systems, Center for Applied
Microstructure Diagnostics) has the great pleasure of
inviting you to meet the experts in electronics reliability
and failure analysis at ESREF 2016: “With regard to current
technology developments andmarket trends in the auto-
motive industries, it is very impressive to note how fast
electronics became one of the most decisive factors for
today’s and future automotive applications. New trends,
such as assisted driving and connected cars, electric
vehicles, or progress in motor and safety management,
are highly dependent on increasinglymore complex semi-
conductor-based systems. In turn, these new application
fields are significantly affecting the technology roadmaps
of the electronics industry. There is no doubt that these
thrilling developments will also pose many new and very
challenging demands specifically on electronics robust-
ness and reliability. Thus, while ESREF 2016 will continue
to consider the full spectrum of reliability topics in elec-
tronics, it will additionally address the field of automotive
electronics reliability as its special topic.”
Mark your calendars for this event, and visit the ESREF
website at esref.org for updated information.
Keynote speaker Sylvestre Maurice and the ChemCam on the Mars
Curiosity
rover