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ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 18 NO. 3
• Session D2: Photonic
• Session D3: Photovoltaic and Organic Devices
• Session E1: Packaging and Assembly
• Session E2: MEMS, MOEMS, NEMS, and Nano-Objects
• Session F: Power Devices
• Session G: Space, Aeronautic, and Embedded Systems
• Session H: European FIB User Group (EFUG)
To draw new attendees and offer returnees an attrac-
tive conference, the organizers expanded the topical
structure of the conference. Each topic was embedded
with invited papers, tutorials, workshops, an oral session,
a posted area for the oral presenters during the session
breaks, and a poster session. The layout of the confer-
ence was set up to allow each attendee to build his or her
optimal schedule by topic or by specific interest without
overlaps. For example, it was possible to follow an expert
training track with two keynotes, ten tutorials, and nine
invited papers. Hélène Fremont and François Marc (IMS,
France), Technical Program Chairs; Peter Jacob (EMPA,
Switzerland) andGiovanni Busatto (University of Cassino,
Italy), Tutorial Chairs; and Mauro Ciappa (ETH Zürich,
Switzerland), Thomas Zirilli (Freescale, France), and Fulvio
Infante (Intraspec Technologies), Workshop Chairs, did an
incredible job of building the best topical tracks.
Local attendance was also targeted. The Local Events
Committee, chairedby AlainBensoussanandAndréDurier
(IRT Saint Exupéry, France), brought regional inputs to
foster local attendance on aeronautic, space, and embed-
ded systems, whichwas a hot topic during the conference.
An opportunity was also provided for students from the
area to participate in a Student Research “Speed-Dating”
session. The award for the best one, “Evidence for Proton
Diffusion in H+ Irradiated DFB and VCSEL Commercial
Laser Diodes” by GiuliaMarcello (Department of Electrical
and Electronic Engineering, University of Cagliari, Italy),
was presented during the gala dinner. Another boost for
local attendance was a specific fee schedule for compa-
nies, with the capability to split the fees into half-days.
The ten workshops and the exhibition at the heart of
the conference provided enhanced networking activities
inapleasant atmosphere. Interactionbetween the attend-
ees and the 21 exhibitors was optimized by integration
of exhibitor flash presentations to underline a specific
technique. These flashpresentationswere fully integrated
into the failure analysis track. All of the catering (coffee
break, lunches, and cocktails on Monday) was held at
Poster session
The ESREF exhibition