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ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 18 NO. 3
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analysis and reliability; fault isolation and defect local-
ization; sample preparation; nondestructive testing
andphysical characterization; andnanoscale electrical
measurement
• Technical seminar: “Chip-Level Advanced Failure
Analysis Case Studies,” organized by gold sponsor
Sector Technologies
• EUFANET Workshop, organized by Jérome Touzel
(Infineon, Germany) and Olivier Crépel (AIRBUS Group
Innovations, France)
The failure analysis track concluded Wednesday
morning with the EFUG session, which had the following
interesting presentations:
• “Focused High- and Low-Energy Ion Milling for TEM
Specimens”
• “TEM Sample Preparation of an SEM Cross Section
Using Electron Beam-Induced Deposition of Carbon”
• “Fabrication of Advanced Probes for Atomic Force
Microscopy Using Focused Ion Beam”
• “Plasma FIB: Enlarge Your Field of View and Your Field
of Applications”
• “Formation of Coupled Cavities in Quantum Cascade
Lasers Using Focused Ion Beam Milling”
This session was followed by the EFUG Workshop,
organized by Hugo Bender (IMEC, Belgium).
At the end of the conference, four awards were made:
• Best Paper:
“System-Level Process -Voltage-
Temperature Variation-Aware Reliability Simulator
Using a Unified Novel Gate-Delay Model for BTI, HCI,
andGOBD” by Taizhi Liu, Chang-ChihChen, Soonyoung
Cha, andLindaMilor. This paperwill bepresentedat the
27th IEEE International Reliability Physics Symposium
(IRPS 2016) in Pasadena, Calif.
• Best Paper:
“Effects of Buffer Compensation Strategies
on the Electrical Performance and RF Reliability of
AlGaN/GaN HEMTs” by David Bisi et al. This paper will
be presented at the 23rd International Symposium on
the Physical and Failure Analysis of Integrated Circuits
(IPFA 2016) in Singapore.
• Best Paper:
“Unusual Defects Generated by Wafer
Sawing: AnUpdate, Including Pick &Place Processing”
by Peter Jacob. This paper will be presented at the
42nd International Symposium for Testing and Failure
Analysis (ISTFA 2016) in Fort Worth, Texas.
• Best Poster:
“A Way to Implement the Electro-Optical
Technique to Inertial MEMS” by Kevin Melendez et al.
This review cannot end without a specific mention of
the pre- and postconference programwith lab tours. The
Laboratory for Analysis andArchitectureof Systems (LAAS)
lab tour on Monday morning included:
• The LAAS clean room, consisting of a 1500 m
2
facil-
ity with classes ranging between 100 and 10,000. Its
manufacturing equipment is devoted to micro- and
nanotechnologies for electronics and optoelectronic
devices.
• ADREAM, an experimental building devoted to experi-
ments concerning energy-savings and green-energy
Social event at the space museum