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ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 18 NO. 4
8. J. Gaudestad, A. Orozco, I. De Wolf, T. Wang, T. Webers, R. Kelley, T.
Morrison, and S. Madala: “Failure Analysis Work Flow for Electrical
Shorts in Triple Stacked 3D TSV Daisy Chains,”
40th Int. Symp. Test.
Fail. Anal. (ISTFA),
ASM International, Nov. 9-13, 2014, pp. 38-42.
9. S. Hong, M.S. Grinolds, L.M. Pham, D. Le Sage, L. Luan, R.L.
Walsworth, and A. Yacoby: “Nanoscale Magnetometry with NV
Centers in Diamond,”
MRS Bull.,
Materials Research Society,
38
, Feb.
2013, pp. 155-61.
10. K.C. Lee, J. Alton, M. Igarashi, and S. Barbeau: “Fast Feature Based
Non-Destructive Fault Isolation in 3D IC Packages Utilizing Virtual
Known Good Device,”
41st Int. Symp. Test. Fail. Anal. (ISTFA),
ASM
International, Nov. 1-5, 2015, pp. 126-29.
11. C. Cassidy, J. Teva, J. Kraft, and F. Schrank: “Through Silicon Via
(TSV) Defects Investigations Using Lateral Emission Microscopy,”
Microelectron. Reliab.,
2010,
50
, pp. 1413-16.
12. K.J.P. Jacobs, A. Khaled, M. Stucchi, T. Wang, M. Gonzalez, K. Cries,
and I. De Wolf: “Light-Induced Capacitance Alteration for Non-
Destructive Fault Isolation in TSV Structures for 3-D Integration,”
accepted for presentation at
42nd Int. Symp. Test. Fail. Anal. (ISTFA),
ASM International, Nov. 6-10, 2016.
13. E. Beyne: “The 3-D Interconnect Technology Landscape,”
IEEE Des.
Test,
May/June 2016,
33
(3), pp. 8-20.
ABOUT THE AUTHOR
Ingrid De Wolf
received a Ph.D. in physics from KU Leuven University, Belgium, in 1989. That
same year, she joined imec in Belgium, where she worked in the field of microelectronics reliabil-
ity, with special attention on gate oxide reliability, mechanical stress analysis using micro-Raman
spectroscopy, and failure analysis. From 1999 to 2014, she headed the group REMO, where research
focuses on reliability, testing, andmodeling of 3-D technology, interconnects, MEMS, and packaging.
She has authored or co-authored 14 book chapters and more than 350 publications and has won
several Best Paper Awards at conferences focusing on reliability and failure analysis. Dr. De Wolf is
chief scientist at imec, an IEEE senior member, and a professor in the materials engineering department at KU Leuven,
where she teaches courses on nondestructive testing, MEMS reliability and failure analysis, characterization techniques,
and failure mode and effects analysis.
IEDM CONFERENCE
The 2016 IEEE International Electron Devices Meeting (IEDM) will be held
December 5 to
7, 2016
, at the Hilton
San Francisco Union Square in San Francisco, Calif. IEDM is a
forum for
reporting breakthroughs in technology, design, manufacturing, physics, and the modeling
of semiconductors and other electronic devices. Topics range from deep-submicron CMOS transistors and memories to
novel displays and imagers, fromcompound semiconductormaterials to nanotechnology devices and architectures, from
micromachined devices to smart-power technologies.
The IEDM is sponsored by the IEEE Electron Devices Society. For more information, visit the IEDM website at
ieee-iedm.org.
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