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ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 18 NO. 4
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ABOUT THE AUTHORS
Zhigang Song
has 19 years of experience in electronic device failure analysis. He has worked at
AMD, Chartered Semiconductor Manufacturing Limited, theMicroelectronics Division of IBM, and cur-
rently works in the failure analysis lab at Globalfoundries, East Fishkill, NY, as a Principal Member of
the Technical Staff. During his failure analysis career, Dr. Song has led failure analysis teams for SRAM
and logic device failure analysis to support advanced silicon-on-insulator and bulk semiconductor
process technology development for the latest several consecutive generations. Dr. Song received
a Bachelor of Science degree from Fudan University, China, in 1988; a Master of Engineering from
Beijing Institute of Chemical Technology, China, in 1990; and a Ph.D. from the National University of
Singapore in 1998. He has published more than 50 papers in journals and at conferences and holds several U.S. patents.
He is also an active ISTFA contributor and participant.
Laura Safran
is currently a diagnostics engineer at Globalfoundries’ Advanced Technology
Development Diagnostics Lab in East Fishkill, NY. During her extensive career in semiconductor
diagnostics and physical failure analysis, she has supported teams in both manufacturing and
development within IBM, Philips Semiconductor, and NXP. Laura holds a Bachelor of Science degree
in materials science from Michigan State University.
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