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ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 19 NO. 1
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secondary ion mass spectrometry, Auger, x-ray photo-
electron spectroscopy, ion scattering spectroscopy) on
top surfaces or in cross section, with a 3-D understanding
of the structure readily available through reconstruction
techniques. It also allows for advancedmaterials process-
ing (nanomachining and growth on pure surfaces) by
reducing the contamination factor.
New ion columns are available (liquidmetal ion source,
liquidmetal alloy ion source, plasma, gas field), andbeams
of gallium, helium, neon, argon, xenon, silicon, gold, and
so on are all possible. Each offers different depth versus
spread, producing varying machining capabilities and
materials processing opportunities.
Amodular platformdesign could allow a purchaser to
specify a varying number of ion columns (or multisource
columns), high-resolution SEM, advanced analytical
techniques, multiple precursor chemistry injectors, and
so on, all in one customizable and reconfigurable system.
The final talk was a late-submission FIB circuit edit
case studybyHideoTanakaof FEI/ThermoFisher Scientific
titled “Controlling TimingDelay onRing-Oscillator Circuits
withQuantized FIB-BasedMetal Insulator Semiconductor
(MIS) Capacitors.” The edit challengewas to add a specific
timing delay to reduce the operating frequency of a ring
oscillator. The operating performance of the ring was
directly measurable, so the impact of any edit could be
quantified. The author noted that the traditional way of
accomplishing this is to add an FIB-deposited resistor, but
this requires two connection vias and a cut—something
there isn’t always room to add. Instead, they took the
approach of adding a capacitor to ground on the output
(single connection to inverter chain and to a nearby
ground). The capacitor itself was made by FIB-deposited
metal-insulator-metal plates. The initial-sized capacitor
slowed the circuit by approximately 200 Hz—not as much
as desired. They then added three additional structures
in parallel until it dropped another 230 Hz to the desired
amount. The takeawaywas that, although the resultswere
not as linear as expected, the technique definitely works.
More study is required to understand the layer deposition
variables that will lead to a predictable capacitance value
for a defined area (dielectric thickness and permittivity
value).
INTERNET RESOURCES
FOR ENGINEERING
COURSERA
URL: coursera.org
Coursera is a compilation of internet lectures from
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GREATEST ENGINEERING ACHIEVEMENTS OF
THE 20TH CENTURY
URL: greatachievements.org
Explore a list of the top 20 achievements from the
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AMERICAN SOCIETY FOR ENGINEERING
EDUCATION (ASEE)
URL: asee.org
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