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ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 18 NO. 1
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ABOUT THE AUTHORS
Mototaka Ito
joined Toray Research Center in 1991, where he conducted analysis of semiconduc-
tors and various industrial materials using Auger electron spectroscopy. He is currently engaged in the
3-D FIB-SEM analysis of semiconductor package interconnections and the investigation of thermally
induced deformation in large-scale integration packages. Dr. Ito received a mas-
ter’s degree from Nagaoka University of Technology and a doctorate from Osaka
University, where he studieddiffusionphenomenon in the interfacebetweenSnAg
X
solder and electroless Au-NiP plating.
Jun Kato
has been engaged in electron microscopy for over 20 years and has worked extensively
in the analysis of materials in semiconductor devices and other advancedmaterials. Most recently, he
has specialized in FIB. He is currently in charge of FIB/SEM analysis at Toray Research Center.
4. J.-W. Nah et al.: “Electromigration in Flip Chip Joints
HavingaThickCuColumnBumpandaShallowSolder
Interconect,”
J. Appl. Phys.,
2006,
100,
p. 123513.
5. Y. Takai et al.: “Analysis of Gas Outbreaking in Micro-
Joining,”
Proc. First Symp. Microjoin. Assem. Technol.
Electron.,
1995, pp. 163-66 (in Japanese).
ENGINEERING EXCELLENCE AWARD WINNER
TheOptical Society named the Logic Analysis Tool (LAT) teamas thewinner of the 2015Paul F. FormanTeamEngineering
Excellence Award. The research teamwas formed in response to a call from the Intelligence Advanced Research Program
Activity (IARPA) for innovative solutions to circuit analysis. The team developed an optics-based LAT that detects the
time-resolved emission of light from switching transistors within integrated circuits (ICs) operating down to 0.5 V, thus
creating a new tool for device analysis in advanced process technologies. The group, led by Dr. Euan Ramsay of DCG
Systems, was comprised of the following:
• The DCGSystems team
(Euan Ramsay, Herve Deslandes, TomKujawa, Ted Lundquist, and Benjamin Cain) was respon-
sible for the construction of a system to measure the spectrum of light emitted by leaking and switching transistors
so that the wavelength range of the final optical system and detectors could be defined. On the basis of these mea-
surements, DCG also developed the optics for collecting the emitted light and bringing it to the Photon Spot fiber for
time-resolved emissionmeasurements from ICs. DCG performed the assembly and initial testing of all subsystems into
one integrated tool. The final prototype configuration allowed diffraction-limited performance over a broad spectral
range with a numerical aperture of more than 2.5.
• The MIT team
(Karl Berggren, Kristen Sunter, and Faraz Najafi) designed and fabricated superconducting nanowire
single-photon detectors, delivering high gain, low jitter, and low noise, for the required time-resolved measurements
of the emission fromswitching transistors. These detectors were optimized inwavelength based on themeasurements
made by IBM and incorporated several novel features.
• The Photon Spot team
(Vikas Anant, Brian Ma, and Juying Shang) developed a closed-cycle cryostat to cool the
superconducting detectors to 800 mK. They also designed a low-jitter electronic interface between the fiber delivery
system fromthe output port of the tool to the superconducting detector and the DCGSystems electronics and software.
• The IBM team
(Peilin Song, Franco Stellari, Andrea Baghat-Shehata, Seongwon Kim, Herschel Ainspan, Christian Baks,
Alan Weger, and Ulrike Kindereit) used the spectral measurement system to determine the emission spectrum trend
from45 and 32 nmprocess technologies at various operating voltages. IBM developed a unique test chip with features
stretching the design rules for prototype characterization and performed the qualification of the various versions of
the prototype tool, including on various 22 and 14 nm test chips (10 nm chips are yet to be available) using proprietary
IBM test technologies. Final testing was carried out by the IBM team.
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