February_EDFA

edfas.org

ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 18 NO. 1

failure analysis, deprocessing and device modifications,

and workflow solutions, such as EFI sample preparation,

nanoprobing, and EBIC and EBAC for fault isolation. The

DualBeamalso offers analytical capabilities, such as EBSD

and energy-dispersive x-ray for chemical, structural, and

compositional analysis.

REFERENCES

1. F. Altman et al.: “Cross Section Analysis of Cu Filled TSVs on High

Throughput Plasma-FIB Milling,”

Proc. Int. Symp. Test. Fail. Anal.

(ISTFA),

Nov. 2012.

2. L. Kwakman et al.: “Characterization and Failure Analysis of 3D

Integrated Systems Using a Novel Plasma-FIB System,”

Proc. AIP

Conf.,

2011, p. 1395.

3. M. Gonzales et al.: “Developing Functional Prototypes by Package

Modification Using Plasma FIB Technology,”

Proc. Int. Symp. Phys.

and Fail. Anal. Integr. Circuits (IPFA),

2012.

4. P. Carleson et al.: “Delayering on Advanced Process Technologies

Using PFIB,”

Proc. Int. Symp. Test. Fail. Anal. (ISTFA),

2014.

5. F. Altman and R. Young: “Site-Specific Metrology, Inspection and

Failure Analysis of Three-Dimensional Interconnects Using Focused

Ion Beam Technology,

J. Micro/Nanolith. MEMS MOEMS

, Jan.-March

2014,

(1), p. 011202.

6. F. Altmann, S. Klengel, J. Schischka, and M. Petzold: “Defect

Analysis Using High Throughput Plasma FIB in Packaging Reliability

Investigations,”

Proc. IEEE Electron. Compon. Technol. Conf. (ECTC),

2013.

(a)

(b)

Fig. 7

(a) 22-nm-node sample deprocessed to contact level with PFIB with probe touchdown. (b) Transistor characteristics of a

22-nm-node device

ABOUT THE AUTHOR

Surendra Madala

is a product marketing manager at FEI in Hillsboro, Ore., focusing on large-area

sample preparation and advanced packaging analysis solutions. He has 20 years of experience in the

areas of IC diagnostics, circuit edit,

IC product engineering, physical and electrical failure analysis and

fault isolation, and semiconductor analytical equipment development and marketing. He holds an

MBA from Southern Methodist University, a Master’s in electrical engineering from the University of

Houston, and a Bachelor’s degree in electrical engineering fromNagarjuna University, India. Surendra

is a member of EDFAS and SEMI.