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edfas.org
ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 19 NO. 1
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Congratulations to the following winners:
ISTFA 2016 BEST PAPER:
“VLP… Demonstrating 110 nm Resolution in Common
Laser Probing Applications”
Travis Eiles, Intel Corp.
ISTFA 2016 OUTSTANDING PAPER:
“Root Cause Analysis for Pin Leakage”
Zhigang Song, Globalfoundries
ISTFA 2016 BEST POSTER:
“Validation of DLS Data by LVP in Case of Marginal
Failure”
Keonil Kim, Samsung Electronics System LSI Division
ISTFA 2016 STUDENT POSTER:
“Solder Ball Reliability Assessment of WLCSP through
Power Cycling”
Bhavna Conjeevaram, University of Texas at Arlington
EDFAS 2016 PHOTO CONTEST
WINNERS
Congratulations to the following winners:
Category I: Color Images
1st Jordan Hendricks, Hi-Rel Laboratories
2nd Eric Cattey, NXP Semiconductors
3rd Richard Park, Raytheon
Category II: Black & White Images
1st Nathan Wang, Maxim Integrated
2nd Lori Sarnecki, Fairchild Semiconductor
3rd Philipp Scholz and Heiko Lohrke, Technische
Universität Berlin
Category III: False Color Images
1st Wentao Qin, ON Semiconductor
2nd Luigi L. Aranda, Raytheon
3rd Andrew Ozaeta, Raytheon
All winners received a recognition plaque or certificate
and a one-year EDFAS membership. The winning entries
will be featured on the cover of thismagazine during 2017.
They also may be viewed on the EDFAS website.
EDFAS 2016 VIDEO CONTEST WINNER
Congratulations to the following winner:
“ACETONEMENT aka: Where Did the BondWires Go?” by
Timothy Hazeldine, ULTRA TEC
The winner received a complimentary registration
to a future ISTFA conference and a first-place winner
plaque. The winning entry may be viewed on the ISTFA
2017 website.
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Electronic Device Failure Analysis
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