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ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 19 NO. 1
ISTFA SPONSORS
Onbehalf of the ElectronicDevice Failure Analysis
Society (EDFAS) and the organizers of ISTFA 2016,
we appreciate your generous sponsorship contri-
bution and recognize your continued commitment
in making the ISTFA Conference and Exposition an
outstanding event!
Sponsors
Allied High Tech Products, Inc.
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The second change was increasing the number of
paper presentations by adding a third parallel track on
Monday afternoon. To be honest, we did not plan for this
but were overwhelmed by the huge influx of high-quality
paper submissions. Thank you! Many more papers made
the cut of the predefined threshold of acceptance. We had
the option of either cutting very good contributions and
keeping the traditional two-track outline, or accepting
papers based on their merits and expanding the program
by adding a third track. We chose the latter.
The third change was a more thorough incorporation
of the ISTFA theme. This year our theme was “The Next
Generation,” and it was featured in the excellent keynote
presentation, “How to Educate the Next Generation IC
Debug/FA Engineer at Academia,” by Prof. Christian Boit
and Dr. Philipp Scholz from the Technische Universität
Berlin. Not only did the keynote speech show that it is
quite possible for academia to educate students who are
Local Student Poster Session participants from the
University of Texas at Arlington with their advisor, Prof.
Dereje Agonafer, and Dr. Felix Beaudoin, ISTFA 2016
Attendee Chair
General Chair Martin Keim and the ISTFA 2016 Organizing Committee
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