February_EDFA

edfas.org

ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 19 NO. 1

The 2016 FA courses addressed many of the usual

topics, such as packaging, power electronics compo-

nents, highly integrated circuits, physical-defect-based

reliability approach, printed circuit board and bonding

processes, as well as many new topics, such as optical,

light-emitting diodes, and laser components; thermal

characterization; how tomanage dynamic reliability; and

helpful tools for FA.

A high-quality FA photo contest created competition

among all the participants. More than 60 photos were

submitted for the photo contest, with six being selected

as the winners.

The sea resort Les Tuquets and its environment as

well as the organization of the event widely favored

exchanges between attendees at all levels, even after the

days’ programs. This was a unique opportunity to share

FA expertise and to deepen the discussion of topics pre-

sented during the sessions as well as business, technical

trends, and so on.

“Single Crystals of Silicon,” aesthetics prize in the

ANADEF Photo Contest

Since 1988, the ANADEF event has been held bienni-

ally. The next workshop is scheduled for 2018. For more

information, visit anadef.org.

• Partner with other international conferences and

organizations to co-host or share contents

• Seek opportunitieswith educational institutes such

as universities to extend EDFAS education offers

What does EDFAS mean to you as a member? Where

do you derive themost value? To growour members, first

and foremost, we need to strengthen EDFAS brand prom-

ises globally, then we need to strengthen our “product

roadmap” and make it accessible to our members.

Finally, we need to reform our membership structure to

accommodate emerging needs, such as new-career and

international electronic failure analysis professionals.

Whenwe joinedEDFASmany years ago, it was the tech-

nical content that attracted us. Today, we are still going

strong! Stronger than ever, as demonstrated by many

years of successful ISTFA conferences and exhibitions,

with many years of effort from many individuals under

the leadership of the EDFAS Board of Directors. We need

to keep it going! We need to sustain our technical excel-

lence by ensuring the premier status of ISTFA, enhancing

EDFA

magazine and

Microelectronic Failure Analysis Desk

Reference

impact, and establishing an educational model

beyond what we are already getting through ISTFA.

How canwe do this? We need to reach out; we need to

collaborate and partner with many related organizations

and institutes, such as semiconductor and equipment

manufacturing companies, to establish a strong electronic

device failure analysis technology roadmap, co-host or

share technical content with other international confer-

ences or organizations, and seek additional educational

opportunities through partnershipwith educational insti-

tutes such as universities. By empowering these, we can

make an impact on the industry we reside in, build a

knowledge pipeline benefitting our members, and, most

importantly, we can grow organically as a Society.

EDFAS is built on volunteerism. The EDFAS Board fully

understands we cannot achieve our strategic objectives

without help from our volunteers. We would like to use

this opportunity to ask each of you today to look inside

yourself and find how you can best promote your profes-

sionanddoa littlebit of good for your professional society.

We need volunteers on all EDFAS committees to keep our

strategic objectives on track. We need volunteers for the

local chapters. We need authors towrite papers topresent

at the conference. There is no end to the ways you can get

involved, andwe challenge you to find thoseways and get

involved! We look forward to seeing you at ISTFA 2017 in

Pasadena, California.

GUEST EDITORIAL

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