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PLASTICS, COMPOSITES & CERAMICS

Electronic Device Failure

Analysis

Magazine

Case Histories • Industry News • Training

Opportunities • Useful URLs • Product News

Ask the Experts

Frequency: 4 issues per year

ISSN: 1537-0755

CODEN: EDFAAO

Product Code: EDFA

Print Price: $122

Contains key information dedicated to

meeting the technical and networking needs of electronic device failure

analysis technicians, engineers, and managers. Technical articles

contributed by experts that cover everything from operations to analysis

techniques. Trends of failure analysis in the microelectronics industry.

News of the Electronic Device Failure Analysis Society

SM

keeps you in the

loop. Guest columns provide vital perspective into FA topics.

ISTFA

2015

Proceedings from the 41st

International Symposium for Testing

and Failure Analysis

2015 • Approx. 500 pages

ISBN: 978-1-62708-102-3

Product Code: 02217G

Price: $167 / ASM or EDFAS

SM

Member: $125

This volume features the latest research and

practical data from the premier event for the

microelectronics failure analysis community.

The papers address the symposium’s theme,

Follow the Data!

ISTFA

2014

Proceedings from the 40th International

Symposium for Testing and Failure Analysis

2014 • 560 pages

ISBN: 978-1-62708-074-3

Product Code: 02216G

Price: $167 / ASM or EDFAS

SM

Member: $125

This volume features the latest research and

practical data from the premier event for the

microelectronics failure analysis community. The

papers address the symposium’s theme, Exploring

the Many Facets of Failure Analysis.

Microelectronics Failure Analysis Desk

Reference, 6th Edition (Book + CD)

Edited by Richard J. Ross

2011 • 674 pages

ISBN: 978-1-61503-725-4

Product Code: 09110Z

Price: $207 / ASM or EDFAS

SM

Member: $155

This updated reference book, prepared by experts in

their fields, contains dozens of articles covering a

range of topics.

The Electronic Device

Failure Analysis Society

SM

This technical society fosters education and communication in

the microelectronics failure analysis community. Get discounts

on publications, software, and educational materials, and

special pricing for the ISTFA conference by joining EDFAS

today.

Visit:

edfas.asminternational.org

FREE

TO EDFAS

MEMBERS

NEW

Composite Filament Winding

Edited by S.T. Peters

2011 • 174 pages

ISBN: 978-1-61503-722-3

Product Code: 05286G

Price: $167 / ASM Member: $125

Topics include capabilities and limitations of filament

winding, practical issues such as fiber and resin

handling, winding theory, software and numerical

control, history of the process, and more.

Optical Microscopy of

Fiber-Reinforced Composites

By Brian S. Hayes and Luther M. Gammon

2010 • 284 pages

ISBN: 978-1-61503-044-6

Product Code: 05303G

Price: $177 / ASM Member: $135

Optical microscopy is one of the most valuable but

under-utilized tools for analyzing fiber-reinforced

polymer matrix composites. Covers sample

preparation, microscopic techniques, and applications. The power to study

the microstructure of heterogeneous, anisotropic materials is illustrated with

over 180 full color images.

MICROELECTRONICS