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ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 18 NO. 3 Services: Chemical analysis, coating/plating thickness,
elemental analysis, environmental, and compositional
analysis testing; counterfeit components detection;
electronics benchmarking; electronics FA; consulting; etc.
Tools/Techniques: Counterfeit components testing,
surface area measurement, SEM-EDX, ED-XRF, bromine
FR analysis, DSC, dilatometry, dye and pry analysis, FTIR
analysis, ICP-AES, joint-strength analysis, LOI, micro-
sectioning, optical microscopy, particle size analysis,
pycnometry, rheometry testing, Rockwell and Vickers
hardness testing, RoHS bromine speciation analysis,
salt spray testing, sieving analysis service, simultaneous
thermal analysis, solderability testing, tensile testing,
UL-94 vertical/horizontal flame test, WD-XRF testing, x-ray
inspection, etc.
ST. LOUIS TESTING LABORATORIES, INC.
2810 Clark Ave.
Saint Louis, MO 63103
Tel: 314.531.8080
e-mail:
Web:labinc.com
Services: Electronic, nondestructive, and mechanical
testing; metallurgical, organic, inorganic, environmental,
and chemical analyses
Tools/Techniques:Cross-sectional analysis, photomicro-
graphs, failure mode and defect analyses, real-time x-ray
radiography, visual inspections, contamination analysis,
wire bond pull tests, four-probe surface resistivity, porta-
ble gamma and x-ray, magnetic particle dry/wetmethods,
liquid penetrant visible and fluorescent, ultrasonic flaw
detection, eddy current, aircraft inspection (FAA certifi-
cate NI2R032L), helium mass, spectrometer leak testing,
certifiedweld inspection (AWS-CWI), ultrasonic thickness,
video borescope, etc.
UMAC AVIONICS PTE LTD.
391B, Orchard Rd., 23-01
Nee Ann City Tower B
Singapore 238874
Tel : +65 83211932
e-mail:
Web:
Services: Electronic and mechanical testing, certifica-
tion
Tools/Techniques: DPA, FA, SEM, electrical performance
and complete component analyses, etc.
W H LABORATORIES
8450 Rayson
Houston, TX 77080
Tel: 713.895.7504
e-mail:
Web:
Services: Metallurgical and nondestructive testing, FA,
weld consulting, expert consulting, etc.
Tools/Techniques: Tensile, bend, shear, compression,
flexural, impact, and hardness testing; ring flattening;
alloy identification; scale and deposit analyses; SEMwith
light-element EDS capability; field PMI; coating testing;
electron microscopy; corrosion evaluation; heat treat
analysis; grain size; fracture mode analysis; wet and dry
fluorescent magnetic particle testing; ultrasonic; flaw
detection; thickness and bond testing; liquid penetrant;
calibration services; etc.
2017 IRPS CONFERENCE
The IEEE International Reliability Physics Symposium’s (IRPS) annual conference will be
held April 2 to 6, 2017, at the Hyatt Regency in Monterey, Calif.
The deadline for submission of paper and poster abstracts is October 15, 2016. IRPS 2017 is soliciting increased par-
ticipation in the following areas: system reliability; middle-of-the-line; extrinsic defect impact on yield and reliability; and
commercial off-the-shelf components in high-reliability applications, including screening, derating, case studies, design
considerations, and so on.
The IRPS Conference is sponsored by the IEEE Reliability Society and IEEE Electron Device Society. For more informa-
tion, visit the IRPS website at irps.org.
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