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ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 18 NO. 3

16

ABOUT THE AUTHORS (continued)

B.L. Yeoh

graduated from the University of Technology, Malaysia, with a B.E. degree in electrical

engineering. In 2006, he joined Intel Microelectronics Malaysia as a failure analysis engineer, where

he specialized in memory testing and failure analysis during his five-year tenure. He is currently

employed as a Member of the Technical Staff at Globalfoundries Singapore. His field of interest

focuses on device fault isolation using a wide range of industry-standard electrical failure analysis

tools, such as photon emission microscopy and laser scanning microscopy techniques (OBIRCH,

TIVA, dynamic laser stimulation, etc.). His current research interests focus on exploring soft defect

localization and laser-assisted device alteration techniques for different failure-type diagnostics in

the semiconductor industry.

G.F. You

holds a B.S. degree in physics fromFuDanUniversity, China; anM.Eng. degree in electrical

engineering from Nanyang Technology University, Singapore; and a Ph.D. degree in the same field

from the National University of Singapore (NUS). Currently, he specializes inwafer-level tester-based

failure debug in Globalfoundries’ Product/Test and Yield Engineering Department, Singapore. His

experiences include dynamic fault isolation techniques, such as frequency mapping and soft failure

localization. Prior to joining Globalfoundries, Dr. You worked as a research fellow at NUS.

Y.H. Chan

graduated fromtheNational Universityof SingaporewithanM.Eng. inelectrical andelec-

tronic engineering. Hewas a test engineer with AMD from2005 to 2008 before joining Globalfoundries

as a diagnostic test lead. Mr. Chan has more than ten years of experience in semiconductor testing,

specializing in automated test equipment (ATE) and burn-in test solution development, implementa-

tion, and debug. He is very familiar with ATE test solution development on the Advantest, Teradyne,

and LTX family of testers, for both engineering sort testing and advanced coding methodologies for

dynamic electrical failure analysis applications. He is also a programmer familiar with C++ and VBA

coding. His current research interests focus on testmethodology optimization for test-time reduction

and multidimensional solution-search algorithms.

Zhao Lin

received her B.E. degree in electrical engineering from the National University of

Singapore in 2015. She then joined Globalfoundries’ Singapore Product/Test and Yield Engineering

Department as a test development engineer. She works on diagnostic testing and focuses on failure

characterizationwith various tester platforms, such as HP93K, TeradyneUflex and J750, andCredence

D-10. Ms. Lin is pursuing an M.S. degree with a specialization in nanoelectronics at the National

University of Singapore.

Jeffrey Lam

received his B.S. and M.S. degrees in chemical engineering from the University of

California Berkeley and the University of California Davis in 1979 and 1981, respectively. He obtained

a second M.S. degree in electrical engineering and computer science from the University of Santa

Clara in 1986. In 2014, he received his Ph.D. from the school of mathematics and physics at Nanyang

Technological University. Dr. Lam is currently a Vice President at Globalfoundries, Singapore, where

he is in charge of the Product/Test and Yield Engineering Department in Technology Development.

He possesses more than 35 years of experience in FA, design, product/yield engineering, and test

development. Dr. Lamhas 7 technical patents andmore than 20 publications. He has also been the chairman of the SEMI

SGP Product and Test Committee since 2009 and an adjunct associate professor at the National University of Singapore.

C.M. Chua

receivedhis Bachelor's andMaster's degrees inengineering fromtheNational University

of Singapore in 1988 and 1990, respectively. He is the Chief ExecutiveOfficer of Semicaps Corporation,

and his current responsibilities include overseeing the general operations of the companies within

the Semicaps Corporation Group.