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ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 19 NO. 1
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Accelerated Analysis...................................................... 56 Allied High Tech........................................................28/29 Applied Beams............................................................... 51 ASM International.......................................................... 31 Checkpoint................................................................48/49 Hamamatsu. .................................................................... 7 JEOL. ................................................................................ 9 Oxford Instruments............................ Outside back cover Quantum Focus Instruments........................................ 21 Semicaps........................................................................ 15 ULTRA TEC.................................. Inside front/back covers Zurich Instruments.......................................................... 3For advertising information and rates
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ABOUT THE AUTHORS
E. JanVardaman
is the president and founder of TechSearch International, Inc., whichhas provided
analysis on technology andmarket trends in semiconductor packaging since 1987. She is the co-author
of
How to Make IC Packages
(published in Japanese by Nikkan Kogyo Shinbunsha), a columnist with
Circuits Assembly Magazine,
and the author of numerous publications on 2.5- and 3-D TSV trends. Jan
is a member of the IEEE Components, Packaging, and Manufacturing Technology (CPMT) Society,
International Microelectronics and Packaging Society, Institute for Interconnecting and Packaging
Electronic Circuits, Microelectronics Packaging and Test Engineering Council, and Semiconductor
Equipment and Materials International. She was elected to two terms on the IEEE CPMT Board of
Governors. Prior to founding TechSearch International, Jan served on the corporate staffof Microelectronics andComputer
Technology Corporation, the electronics industry’s first precompetitive research consortium.
Linda Bal,
senior analyst, has more than 25 years’ experience in the design, test, and manufac-
turing of electronic packaging for semiconductors and systems. She has held positions at Freescale,
Motorola, Microelectronics and Computer Technology Corporation, and Eastman Kodak and has also
authoredor co-authorednumerous publications. She is amember of IEEE, JEDEC, and the
International
Microelectronics Assembly and Packaging Society (IMAPS). A member of the IMAPS technical com-
mittee since 2007, Linda’s contributions include chairing the flip-chip/wafer-level packaging track for
the Device Packaging Conference in 2013 and 2014, co-chairing the flip-chip track in 2009 and 2010,
and moderating technical panel discussions in 2011 and 2012. Linda received her BSEE degree from
Purdue University in 1985.