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ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 19 NO. 1
50
LITERATURE REVIEW
T
he current column covers peer-reviewed articles published since 2014 on thermography and thermal-related
phenomena. Note that inclusion in the list does not vouch for the article’s quality, and category sorting is by no
means strict.
If you wish to share an interesting recently published peer-reviewed article with the community, please forward the
citation to the e-mail address listed above and I will try to include it in future installments.
Entries are listed in alphabetical order by first author, then title (in bold), journal, year, volume, and first page. Note
that in some cases bracketed text is inserted into the title to provide clarity about the article subject.
Peer-Reviewed Literature of Interest to Failure Analysis:
Thermography and Thermal-Related Phenomena
Michael R. Bruce, Consultant
mike.bruce@earthlink.net• M.S. Anwar, J. Alam, M. Wasif, et al.:
“Fourier Analysis
of Thermal Diffusive Waves,”
Am. J. Phys.,
2014,
82
,
p. 928.
• D.G. Cahill, G. David, L. Shi, et al.:
“Nanoscale Thermal
Transport. II. 2003–2012,”
Appl. Phys. Rev.,
2014,
1
, p.
011305.
• D.R. Cremons, D.A. Plemmons, and D.J. Flannigan:
“Femtosecond E l ec t ron [ V i deo ] Imag i ng
of Defect-Modulated Phonon Dynamics [in
Semiconductors],”
Nat. Commun.,
2016,
7
, p. 11230;
also see D. McCormick:
“Watch [Nanoscale] Heat
Surge across Semiconductors at the Speed of
Sound,”
IEEE Spectrum,
April 19, 2016, spectrum.
ieee.org/tech-talk/at-work/test-and-measurement/
video-sees-heat-surge-across-nanometers-at-the-
speed-of-sound, accessed April 20, 2016.
• T. Favaloro, J.-H. Bahk, and A. Shakouri:
“Charac-
terization of the Temperature Dependence of the
Thermoreflectance Coefficient for Conductive Thin
Films [in Electronic Devices],”
Rev. Sci. Instrum.,
2015,
86
, p. 024903.
• F. Fertig, J. Greulich, and S. Rein:
“Spatially Resolved
Determination of the Short-Circuit Current Density
of Silicon Solar Cells via Lock-In Thermography,”
Appl. Phys. Lett.,
2014,
104
, p. 201111.
• R. Heiderhoff, A. Makris, and T. Riedl:
“Thermal
Microscopy of Electronic Materials,”
Mater. Sci.
Semicond. Process.,
2016,
43
, p. 163.
• J. Hepp, F. Machui, H.-J. Egelhaaf, et al.:
“Automatized
Analysis of IR-Images of Photovoltaic Modules and
Its Use for Quality Control of Solar Cells,”
Energy Sci.
Eng.,
2016,
4
, p. 363.
• W. Jeong, S. Hur, E. Meyhofer, et al.:
“Scanning Probe
Microscopy for Thermal Transport Measurements,”
Nanoscale Microscale Thermophys. Eng.,
2015,
19
, p.
279.
• D.U. Kim, K.S. Park, C.B. Jeong, et al.:
“Quantitative
Temperature Measurement of Multi-Layered
Semiconductor Devices Using Spectroscopic
Thermoreflectance Microscopy,”
Opt. Express,
2016,
24
, p. 13906.
• M. Kuball and J.W. Pomeroy:
“A Review of Raman
Thermography for Electronic and Opto-Electronic
Device Measurement with Submicron Spatial and
NanosecondTemporal Resolution,”
IEEETrans. Device
Mater. Reliab.,
2016,
16
, p. 667.
• J. Maassen and M. Lundstrom
: “Steady-State Heat
Transport: Ballistic-to-Diffusivewith Fourier’s Law,”
J. Appl. Phys.,
2015,
117
, p. 035104.
• F. Menges, H. Riel, and A. Stemmer:
“Nanoscale
Thermometry by Scanning Thermal Microscopy,”
Rev. Sci. Instrum.,
2016,
87
, p. 074902.
• M. Partanen, K.Y. Tan, and J. Govenius:
“Quantum-
Limited Heat Conduction over Macroscopic
Distances,”
Nat. Phys.,
2016,
12
, p. 460.
• D. Pile:
“InfraredOptics: NanoscaleHeat [Transfer],”
Nat. Photon.,
2016,
10
, p. 79.
• S.Y.Ryu,D.K.Kim,J.K.Kim,etal.:
“Surface-Temperature
Measurement and Submicron Defect Isolation for