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ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 19 NO. 1
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DIRECTORY OF
INDEPENDENT FA PROVIDERS
Rosalinda M. Ring, Qorvo Corp.
rosalinda.ring@qorvo.comE
lectronic companies of all types and sizes require failure analysis (FA) services. Our goal is to supply a resource of FA
service providers for your reference files. The directory lists independent providers and their contact information,
expertise, and types of technical services offered.
ADVANCED CIRCUIT ENGINEERS, LLC
308 S. Abbott Ave.
Milpitas, CA 95035
Tel: 408.719.1617
e-mail:
sales@advancedcircuitengineers.comWeb: advancedcircuitengineers.com
Services:
FIB circuit edit and debug
Tools/Techniques:
FIBprecisionflip-chip/frontside circuit
edits, local deprocessing, low-current end-point detec-
tion, dual-beam FIB for STEM and S/TEM sample prep,
TEM lift-out (Easylift) nanomanipulator, SEM/EDX, sample
preparation (mechanical cross-section polishing), etc.
BALAZS NANOANALYSIS
46409 Landing Parkway
Fremont, CA 94538
Tel: 510. 624.4000
e-mail:
info@balazs.com
Web:
www.balazs.comServices:
Process material testing, contamination iden-
tification, consulting, R&D, on-site laboratories, optima
seminars, etc.
Tools/Techniques:
Optical microscope, FTIR, GC-MS, ion
chromatography, ICP-MS, GD-OES, ICP-OES, LA ICP-MS,
SEM-EDS, SIMS, UV/vis spectroscopy, XRF, AES, ESCA/XPS,
interstitial gas analysis, minority carrier lifetimemeasure-
ment, Rutherfordbackscattering spectroscopy, TOF-SIMS,
XRD, TXRF, etc.
CONTECH RESEARCH
750 Narragansett Park Dr.
Rumford, RI 02916
Tel: 401.865.6440
e-mail:
info@contechresearch.comWeb: contechresearch.com
Services:
Environmental, electrical, and mechanical
testing
Tools/Techniques:
Surface analysis, SEM, SAM, FTIR, fret-
ting corrosion and evaluation, etc.
ECR LABORATORY, INC.
916 Commercial St.
Palo Alto, CA 94303
Tel: 408.727.5100
e-mail:
info@ecrlab.comWeb: ecrlab.com
Services:
FA, electrical measurements/characterization,
counterfeit IC detection and analysis, construction analy-
sis, destructive physical analysis, reliability testing, etc.
Tools/Techniques:
Die deprocessing; package decapsula-
tion; cross sectioning; parallel and angle lapping; optical
microscopy; radiographic (x-ray) inspection/imaging; SEM
and destructive physical analyses; burn-in; life testing;
HAST; autoclave; stabilization bake; 85 °C/85%RH testing;
temperature cycle (air to air); thermal shock (liquid to
liquid); moisture resistance, salt spray (salt atmosphere),
vibration, mechanical shock, acceleration, and solder-
ability testing; C-SAM; EDS; XRF spectrometry; AES; TDR;
SPICEmodels extraction and validation; test chips layout
design, etc.
MICROTECH LABORATORIES
538 Haggard St., Suite 402
Plano, TX 75074
Tel: 972.633.0007
e-mail:
contact@micro-labs.comWeb: microtechlaboratories.com
Services:
FA; component, PCBA, and reverse-engineering
construction analyses; design debug; consulting; train-
ing; etc.
Tools/Techniques:
Liquid crystal, package decapsula-
tion, cross sectioning, backside sample preparation, die
deprocessing, emissionmicroscopy, FIB sample prepara-
tion, mechanical probing, FIB circuit edit, real-time x-ray,
SAM, SEM/EDS, etc.
NANOTECH ANALYTICAL SERVICES AND TRAINING
CORP.
Block 136, Lot 1 C, Arellano St.
Katarungan Village (Daang Hari) Poblacion
Muntinlupa City, Philippines 1776
Tel: + 63 2 576 8922
e-mail:
customercare@nasatcorp.comWeb: nasatcorp.com
Services:
Materials characterization, FA, seminars and
workshops, tool training, consulting, research collabora-
tion, etc.
Tools/Techniques:
SEM-EDX, AFM, IR-OBIRCH, hybrid