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ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 19 NO. 1
2
PURPOSE: To provide a technical condensation of
information of interest to electronic device failure
analysis technicians, engineers, and managers.
Felix Beaudoin
Editor/Globalfoundries; felix.beaudoin@
globalfoundries.com
Scott D. Henry
Publisher
Mary Anne Fleming
Manager, Technical Journals
Kelly Sukol
Production Supervisor
Liz Marquard
Managing Editor
ASSOCIATE EDITORS
Nicholas Antoniou
Revera, Inc.
Michael R. Bruce
Consultant
David L. Burgess
Accelerated Analysis
Jiann Min Chin
Advanced Micro Devices Singapore
Edward I. Cole, Jr.
Sandia National Labs
James J. Demarest
IBM
Szu Huat Goh
Globalfoundries Singapore
Ted Kolasa
Orbital ATK
Andreas Meyer
Globalfoundries
Philippe H.G. Perdu
CNES France
Rose M. Ring
Qorvo, Inc.
Paiboon Tangyunyong
Sandia National Labs
David P. Vallett
PeakSource Analytical, LLC
E. Jan Vardaman
TechSearch International, Inc.
Martin Versen
University of Applied Sciences Rosenheim, Germany
Lawrence C. Wagner
LWSN Consulting Inc.
GRAPHIC DESIGN
PRESS RELEASE SUBMISSIONS
Electronic Device Failure Analysis™ (ISSN 1537-0755) is pub-
lished quarterly by ASM International®, 9639 Kinsman Road,
Materials Park, OH 44073; tel: 800.336.5152; website: edfas.
org.Copyright©2017byASM International.Receive Electronic
Device Failure Analysis as part of your EDFAS membership
of $88 U.S. per year. Non-member subscription rate is $135
U.S. per year.
Authorizationtophotocopy itemsfor internalorpersonaluse,
orthe internalorpersonaluseofspecificclients, isgrantedby
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Service, provided that the base fee of $19 per article is paid
directlytoCCC,222RosewoodDrive,Danvers,MA01923,USA.
Electronic Device Failure Analysis is indexed or abstracted by
Compendex, EBSCO, Gale, and ProQuest.
The ever-changing semiconductor industry and the
diversity and dynamics of the electronic failure
analysis community require the leaders of the
Electronic Device Failure Analysis Society (EDFAS) to
reassess value propositions and realign accordingly the
directions we are heading on a timely basis.
We just finished our Board of Directors’ face-to-face
meeting during the 2016 International Symposium for
Testing and Failure Analysis (ISTFA) in Fort Worth, Texas,
where we defined our EDFAS strategic objectives. As
shown below, our strategic objectives are centralized
on “strengthen our member resources and grow,” with
focuses on threemajor areas: membership growth, technical excellence, and
strategic collaboration and partnership.
EDFAS Strategic Objectives
Strengthen Our Credential and Grow
☐ ☐ Membership:
• Improve EDFAS brand credential and awareness by communicating
through global networks
• Strengthen EDFAS forward-looking “product roadmap” to bring ser-
vices and items of value tomembers andmake them easily accessible
through website and social media
• Develop a tailoredmembershipmodel to encourage “new-career” and
international professionals
☐ ☐ Technical Excellence:
• Ensure ISTFA is the premier conference and exhibition for the global
electronic failure analysis industry
• Enhance EDFA magazine and desktop reference technical content as
the “go-to” sources for global electronic failure analysis industry
• Establish EDFAS technical leadership through education beyond just
the means of ISTFA conference
☐ ☐ Strategic Collaborations and Partnership:
• Establish a FA technology roadmap by collaboratingwith semiconduc-
tor and equipment manufacturing institutes
FEBRUARY 2017 | VOLUME 19 | ISSUE 1
A RESOURCE FOR TECHNICAL INFORMATION AND INDUSTRY DEVELOPMENTS
ELECTRONIC DEVICE
FAILURE ANALYSIS
(continued on page 24)
GUEST EDITORIAL
STRATEGIC OBJECTIVES FOR EDFAS
Zhiyong Wang, Maxim Integrated, EDFAS President
Lee Knauss, IARPA, EDFAS Vice President
Cheryl Hartfield, EDFAS Immediate Past President