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ASM

NEWS

AFFILIATE SOCIETIES NAME COMMITTEE

CHAIRS FOR 2015-2016 TERM

In This Issue

49 Affiliates Name Committee Chairs 51 Call for Volunteers 54 Chapter News 55 Members in the News 56 In Memoriam

ASM

NEWS

Submit news of ASM and its members, chapters, and affiliate societies to Frances Richards, editor, ASM News | ASM International

9639 Kinsman Road | Materials Park, OH 44073 | P 440.338.5151 ext. 5563 | F 440.338.4634 | E

frances.richards@asminternational.org

Contact ASM International at 9639 Kinsman Road, Materials Park, OH 44073 | P 440.338.5151 ext. 0 or 800.336.5152 ext. 0 (toll free in U.S.

and Canada) | F 440.338.4634 | E

MemberServiceCenter@asminternational.org

| W

asminternational.org

A D V A N C E D

M A T E R I A L S

&

P R O C E S S E S | F E B R U A R Y

2 0 1 6

4 9

T

he Boards of the Electronic Device Failure Analysis Soci-

ety (EDFAS), Heat Treating Society (HTS), International

Metallographic Society (IMS), and Thermal Spray Soci-

ety (TSS) have appointed chairs to each of their committees

for the 2015-2016 term. Chairs for ASM Society and General

Committees and Councils appeared in the January 2016 issue

of

ASM News

. The purpose of each committee is stated on the

ASM website,

asminternational.org

. Click on Membership and

Committees, followed by Committee Involvement, and then

Affiliate Committees.

Electronic Device Failure

Analysis Society (EDFAS)

Cheryl Hartfield,

business manager-Omniprobe

Products, Oxford Instruments, USA, continues to serve as

president of EDFAS.

Jeremy A. Walraven,

technical staff, Sandia National

Laboratories, Albuquerque, N.M., serves as immediate past

president and chair of the EDFAS Nominating Committee.

Mayue Xie,

engineering TDmanager, Intel Corp., Chan-

dler, Ariz., was named chair of the Education Committee.

Tom Moore,

president, Waviks Inc., Dallas, continues

as chair of the EDFAS Membership Committee.

Efrat Moyal,

cofounder, LatticeGear LLC, serves as

co-chair.

Felix Beaudoin,

functional characterization engineer,

GlobalFoundries, Hopewell Junction, N.Y., is chair of the

Electronic Device Failure Analysis

Magazine Committee.

Martin Keim,

engineering manager, Mentor Graphics,

Wilsonville, Ore., was named chair of the Events Commit-

tee and is general chair of ISTFA 2016.

Sam Subramanian,

senior member of technical staff, Freescale Semiconductor,

Austin, Texas, serves as vice chair.

David Su,

director, TSMC, Taiwan, was named chair of

the International Growth Committee.

Moore

Moyal

Beaudoin

Hartfield

Walraven

Xie

Kowalski

Jones

Schneider

Keim

Subramanian

Su