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ADVANCED MATERIALS & PROCESSES •

FEBRUARY 2014

43

ASM

news

www.asminternational.org/ASMnews

Submit news of ASM and its members, chapters, and affiliate societies to

Joanne Miller, editor,

ASM News

• ASM International, 9639 Kinsman Road, Materials Park, OH 44073

tel:

440/338-5151, ext. 5662

fax:

440/338-4634

e-mail:

joanne.miller@asminternational.org

Contact ASM International at

9639 Kinsman Road, Materials Park, OH 44073

tel:

440/338-5151, ext. 0, or 800/336-5152, ext. 0

(toll free in U.S. and Canada)

fax:

440/338-4634

e-mail:

MemberServiceCenter@asminternational.org

website:

www.asminternational.org

®

43 Affiliate Societies’ Committee Chairs 44 Student Board Member Applications 45 Seeking Nominations

Affiliate Societies’ Committee Chairs

Named for 2013-2014 Term

46 New Foundation Director 47 Chapter News 48 Members in the News

...in this issue

T

he Boards of the Electronic Device Failure Analysis So-

ciety (EDFAS), Heat Treating Society (HTS), Interna-

tional Metallographic Society (IMS), and Thermal Spray

Society (TSS) have appointed chairs to each of their com-

mittees for the 2013-2014 term. Chairs for ASM Society and

General Committees and Councils appeared in the January

2014 issue of

ASM News

. The purpose of each committee is

stated on the ASMwebsite,

www.asminternational.org

. Click

on Membership and Committees, followed by Committee

Involvement, and then Affiliate Committees.

ELECTRONIC DEVICE

FAILURE ANALYSIS SOCIETY (EDFAS)

Jeremy A. Walraven,

technical staff, Sandia National Lab-

oratories, Albuquerque, N. M., continues to serve as presi-

dent of EDFAS.

Susan Li,

device analysis lab manager, Spansion Inc., Sun-

nyvale, Calif., continues to serve as chair of the Education

Committee.

Leo G. Henry

, managing engineer, ESD TLP

Consulting, Fremont, Calif., continues to serve as vice chair.

Tom Moore,

president, Waviks Inc., Dallas, continues as

chair of the Membership and Nominating Committees.

Felix Beaudoin,

functional characterization engineer, In-

ternational Business Machine, Hopewell Junction, N.Y., was

named chair of the

Electronic Device Failure Analysis

Mag-

azine Committee.

Dan J. Bodoh,

FA tools development, Freescale Semicon-

ductor, Austin, Texas, was named chair and

James J. De-

marest,

advisory engineer, International Business Machine,

Albany, N.Y., was named vice chair of the Events Committee.

Mr. Bodoh is general chair of ISTFA 2014.

Philippe Perdu,

senior expert, CNES, Toulouse,

France, continues to serve as chair of the International

Growth Committee.

HEAT TREATING SOCIETY (HTS)

Roger A. Jones,

cor-

porate president, Solar

Atmospheres Inc., Soud-

erton, Pa., was elected

president of HTS.

Thomas E. Clements

,

Engineering

Manager-

Metals and Thermal

Processes, Caterpillar Inc.,

is currently serving as

HTS immediate past pres-

ident, as well as chair of

the HTS Awards &Nomi-

nations and the HTS Fi-

nance Committees.

Richard D. Sisson, Jr.,

FASM,

director, Manu-

facturing and Materials

Engineering, Worcester Polytechnic Institute, Worcester,

Mass., continues to serve as chair of the HTS Education

Committee.

Michael J. Schneider, FASM

, general manager,

Prod. Materials and Metallurgy, The Timken Company,

North Canton, Ohio, was named vice chair.

Continued on next page

Walraven Li Henry Moore

Beaudoin Bodoh Demarest Perdu

Jones Clements

Sisson Schneider