57
ADVANCED MATERIALS & PROCESSES •
AUGUST 2014
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Advanced Materials & Technology Services Inc.
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Christian Bürkert GmbH & Co. KG
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DeWAL Industries Inc.
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Epsilon Technology Corp.
58
Guyson Corp.
35
Master Bond Inc.
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NSL Analytical Services Inc.
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Oerlikon Metco
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Progressive Surface
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Saint-Gobain Coating Solutions
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Struers Inc.
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Surface Modification Systems Inc.
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Westmoreland Mechanical Testing & Research Inc.
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classifieds
erating temperature of -65° to 250°F, and is temperature
compensated from 60° to 160°F.
tecsis.us.
Park Systems, Korea, announces Park NX-Wafer, a revolution-
ary
atomic force microscopy (AFM) design
for bare wafer
manufacturing that fully automates the defect review process
and increases production throughput by 1000%. The micro-
scope produces sub-Angstrom roughness measurements for
the flattest substrates and wafers with tip-to-tip variation of
less than 2%. The device also features a long range sliding
stage that combines with NX-Wafer to become an atomic
force profiler (AFP). The new low noise AFP provides very flat
profiling to 50 mmwith profiling speed as fast as 1 mm/sec for
both local and global uniformity measurements including dish-
ing, erosion, and edge-over-erosion (EOE) after chemical me-
chanical polishing (CMP).
parkafm.com.
SiVance LLC, Spartanburg, S.C., a subsidiary of Milliken &
Co., released SiVance C1008 Curative, a
new silicone cur-
ative
that significantly improves the durable flexibility of
epoxy polysiloxane protective topcoats in marine and infra-
structure applications, without sacrificing weatherability. This
development solves a major challenge common to epoxy
polysiloxanes—brittleness and cracking that can develop
over time as the coating cures. The product is fully miscible
with hydrogenated bisphenol-A epoxy resins. Compatibiliza-
tion of C1008 Curative in other epoxy resins is possible with
the use of solvents (methyl ethyl ketone (MEK), xylenes, etc.)
or reactive diluents.
millikenchemical.com/sivance.ZEISS, Germany, introduces its latest
photomask qualifica-
tion system,
the AIMS 1x-193i. The new system supports the
further extension of 193-nm lithography and meets the chal-
lenging requirements of advanced lithography techniques
such as multi-patterning and source mask optimization. It also
enables users to qualify the optical performance of a mask
under scanner equivalent illumination condi-
tions. The AIMS 1x-193i works with 193-nm
illumination and benefits from a completely
redesigned optical system. Another highlight
is a significantly improved CD repeatability
enabling more accurate defect qualification
that stays ahead of the requirements of the
ITRS roadmap as the industry move to
smaller feature sizes.
zeiss.com/sms.The NanoSteel Co., Providence, R.I., announces a portfolio
of
ferrous powders
designed to extend steel’s capabilities
in near-net shape wear parts for highly abrasive environ-
ments. These new alloys feature hardness in excess of 1400
HV, wear resistances well below 10 mm
3
volume loss (ASTM
G-65), and spherical morphology that results in excellent
packing factors and flowability important for producing
high-density parts under tight dimensional control. This
family of new powders enables production of extreme hard-
ness wear parts through a wide variety of consolidation
processes, including additive manufacturing, without the
need for subsequent heat treatment.
nanosteelco.com.




