

A D V A N C E D
M A T E R I A L S
&
P R O C E S S E S |
S E P T E M B E R
2 0 1 5
3 1
TABLE 3—RELATIVE INTENSITIES OF TA 4F OXIDE AND REDUCED
COMPONENTS BEFORE AND AFTER SPUTTER-CLEANING
Cleaning method
Ta 4f oxide Ta 4f reduced
None
100
-
Cluster ions
100
-
200eV monatomic
70.4
29.6
TABLE 2—ATOMIC CONCENTRATIONS BEFORE
AND AFTER CLUSTER-CLEANING
Name
As-received
atomic %
After cluster
cleaning atomic %
C
50.7
0
O
33.7
71.8
Ta
11.8
28.2
Si
3.8
0
Fig. 4 —
Comparison of Ta 4f spectra for monatomic Ar
+
and
argon cluster ion sputter-cleaning of Ta
2
O
5
.
Fig. 3 —
Comparison of XPS survey spectra before and after argon cluster
ion cleaning.
Hackensack, NJ 07601, USA +1.201.343.8983 main masterbond.com www.masterbond.com ONE COMPONENT, NON-DRIP ADHESIVE for STRUCTURAL BONDING TEMPERATURE RANGE Serviceable from -60°F to +500°F EPOXY SYSTEM STRENGTH PROFILE Tensile strength, 75°F >8,000 psi Compressive strength, 75°F >18,000 psi ELECTRICAL INSULATION Volume resistivity, 75°F >10 14 ohm-cm