edfas.org ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 28 NO.4 38 509.325.5800 hrlabs.com Services Offered: Specializes in the analysis and testing of microelectronics and materials technology. Tools and Techniques: Destructive physical analysis, failure analysis, materials analysis, counterfeit detection, real-time x-ray, 3D CT x-ray/laminography, acoustic microscopy (SAM), FIB sectioning, SEM, EDS, FTIR, optical microscopy, prohibitive materials analysis (PMA), particle impact noise detection (PIND), hermeticity (fine and gross leak), delid/decap/laser ablation, visual inspection (internal and external), bond pull, die shear, color dot identification, infrared hot spot detection, cross section, physical dimensioning, energy dispersive x-ray fluorescence (EDXRF), wafer lot acceptance testing (WLAT), SEM qualification, precision metallographic examination, and laser induced breakdown spectroscopy (LIBS). MATERIALS TECHNOLOGY ASSOCIATES 958 San Leandro Ave., Suite 600 Mountain View, CA 94043 650.815.1606 mikeblum@mtalabs.com mtalabs.com Services Offered: Failure analysis and corrosion testing services. Tools and Techniques: Visual and stereoscopic microscope examination, radiographic examination, fractography, SEM examination, metallographic sectioning, surface analysis, hardness and microhardness testing, profilometry, low load mechanical testing, auger and XPS, liquid penetrant test, welding and braze evaluation, FTIR, and x-ray diffraction. PROCESS SCIENCES INC. 310 Brushy St. Leander, TX 78641 512.259.7070 process-sciences.com Services Offered: BGA reballing/rework, circuit assembly rework and repair, x-ray inspection, failure analysis, SMT process validation, ion chromatography services, C3 ionic cleanliness testing, and counterfeit detection. Tools and Techniques: C3 ionic cleanliness testing, Bowman XRF tool, XRF plating thickness measurement, CT x-ray and virtual cross-sections, SEM|EDS, BGA crack analysis, microsection analysis, Dionex ion chromatography, and dye and pry test. REVENG 5 Bates Dr., Suite 8 Carleton Place, Ontario K7C 4J8 613.867.3979 info@revengic.com revengic.com/lab-services Services Offered: Reverse engineering services for micro- electronics. Tools and Techniques: Process analysis, circuit extraction, intellectual property EoU, world-class microchip delayering, cross sectioning, backside poly, bevel, EDX materials analysis, product teardown, die photo, PCB delayering, decapsulation, x-rays, PCB and IC analysis, device manipulation, sample imaging (optical or SEM), substrate staining n/p, TEM, and scanning capacitance microscopy. SERMA MICROTECH 538 Haggard St., Suite 402 Plano, TX 75074 972.633.0007 serma-microtech.com/failure-analysis/turn-key-failure- analysis Services Offered: Turnkey failure analysis, circuit extraction services, component analysis, PCBA analysis, and design debug services. Tools and Techniques: Scanning acoustic microscopy (SAM), SEM, EDS, FTIR, real-time x-ray, sample preparation, FIB, decapsulation, backside sample preparation, reverse engineering, product teardowns, transmission electron microscopy (TEM), electron energy loss spectroscopy (EELS), mechanical probing, emission microscopy, thermal-induced voltage acceleration. SGS CANADA INC. 6755 Mississauga Rd. Mississauga, Ontario, Canada L5N 7Y2 905.364.3771 sgs.com/en-ca/services/semiconductor-failure-analysis Services Offered: AEC qualification semiconductor testing, semiconductor chemical services, failure analysis, and material analysis. Tools and Techniques: Atomic force microscope (AFM), field emission scanning electron microscope (FESEM), TEM, electron microprobe analysis (EPMA), energy dispersive x-ray spectroscopy (EDX), x-ray photoelectron spectroscopy (XPS), auger electron spectroscopy (AES), secondary ion mass spectrometry (SIMS), time of flight secondary ion mass spectrometry (TOF-SIMS), FTIR, XRD, spreading resistance profile (SRP), dynamic secondary ion mass spectrometry (D-SIMS), I-V curve tracer, photon emission, thermal emission, decapsulation, delayering (chemical etching/reactive ion etching), cross section, ion milling, FIB, cross section/circuit modification, JESD47: stress-test driven qualification of integrated circuits, JESD22-A113: preconditioning of non-hermetic surface mount device prior to reliability testing, JESD22-A108: high/low temperature operating life test (HTOL/LTOL), JESD22-A103: high/low storage life test (HTS), JESD22-A119: low storage life test (LTS), JESD22-A104: temperature cycling (TC), JESD22-A105: power and temperature cycling test (PTC), JESD22-A101: temperature and humidity bias test (THB), JESD22-A110: highly accelerated temperature and humidity stress test (HAST), JESD22-A118: unbiased accelerated temperature and humidity stress test (UHAST), JEDEC JS-001, JS-002 and JESD78: ESD and latch-up test (HBM/ MM/CDM/latch-up), and JESD22-B series: board level reliability test (BLR TC, BLR bend).
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