edfas.org 35 ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 28 NO. 4 encourage co-development of novel analytical techniques and equipment between FA engineers, academia, and vendors; and gather information on the needs of FA engineers and guide vendors to focus development efforts that fulfill such needs. Given the immense pressures of the modern-day work environment, coupled with the complexity of cutting-edge technologies, it is nearly impossible to develop analytical methods and equipment solely by oneself. Some of the “walls of competition” need to come down for the betterment of all. Collaboration and information exchange is essential and will ultimately benefit the entire semiconductor analysis community. Efrat Moyal is sales director at Zeiss Microscopy where she has been since 2021. She held previous roles at Oxford Instruments, Omniprobe Inc., Gatan Inc., and Sela Inc., among others. Moyal has authored several publications and holds a patent. Vision Statement Elevating Failure Analysis from a Cost Center to a Strategic Design Partner. Throughout my 30 years career, I have seen a recurring struggle: Failure analysis and lab activities are often treated as a reactive afterthought. As a society, we must shift this perception by championing the integration of FA into the earlier stages of the design process. I propose that we actively target the design community and executive management by creating dedicated sessions at ISTFA focused on design for FA and the ROI of early-stage reliability. By showing managers the direct link between FA and accelerated time to market, we help our community to secure the visibility and budgets they need for advanced capabilities. Revitalizing our Community through Local En- gagement and Mentorship. A healthy society cannot survive on a once a year gathering alone. Much of our value lies in tribal knowledge, the expertise exchanged through personal networking that isn’t found in textbooks. I intend to lead an initiative to revitalize local chapters, creating a year-round ecosystem for learning. Furthermore, we must address our aging demographic. We need a deliberate passing of the torch where the younger generation is empowered to lead with passion, while veteran members transition into vital advisory roles. This ensures our expertise is preserved while the Society is infused with new energy. Growth through Digital Accessibility and Cross- Functional Alliances. To grow, we must look inward at our digital tools and outward at neighboring industries. We need to evolve our digital resources into a global knowledge hub accessible to a modern workforce. Simultaneously, we must bridge the gap between semiconductor FA and adjacent functions like system level electronics. There is a wealth of knowledge in the broader electronics world that can benefit us, but these synergies require a dedicated board level initiative to build formal relationships with adjacent societies. Lesley Endrinal is a distinguished semiconductor failure analysis technical leader with more than 25 years of sustained achievement across failure analysis, product, test, yield, and reliability engineering. Her career is defined by a continuous trajectory of technical innovation, measurable business impact and industry leadership that has advanced semiconductor technology across generations. In 1999, Endrinal earned her bachelor of science degree in electronics and communications engineering from the University of the Philippines, specializing in digital signal processing. In recognition of her academic excellence, she was invited to join the electrical engineering department as an instructor, where she taught core EE courses and mentored undergraduate students. Since 2023, Endrinal has been sharing her expertise as an ISTFA tutorial speaker on ATE-Based Failure Analysis Techniques and was a significant contributor in the FA section of the SRC Microelectronics and Advanced Package Technologies 2.0 Roadmap. Endrinal recently became senior director of Global Failure Analysis at Qualcomm after spending years at Google, where she built their first silicon EFI Lab. She held previous roles at Qualcomm, NXP Semiconductors, Intel, and Analog Devices Inc. Vision Statement The semiconductor industry is facing an unprecedented development in heterogenous packaging and sub-2nm nodes that pushes the boundaries of failure analysis. My vision is to be a driving force within the organization and steer the EDFAS Roadmap toward a more “forwardlooking” approach, rather than firefighting mode for FA development, mobilizing developments, not only on the tools and techniques but also influencing external stakeholders such as EDA vendors and designers in consciously
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