edfas.org 41 ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 28 NO. 3 DIRECTORY OF INDEPENDENT FA PROVIDERS Rosalinda M. Ring, NenoVision jmj4papa@yahoo.com Electronic companies of all types and sizes require failure analysis (FA) services. Our goal is to supply a resource of FA service providers for your reference files. The directory lists independent providers and their contact information, expertise, and types of technical services offered. AAA ENGINEERING AND TEST LAB 877.369.6547 customerservice@aaactl.co aaactl.com/services Services Offered: Comprehensive electronic component testing, environmental testing, failure analysis, Hi-Rel, and space qualification. Tools and Techniques: Bond wire harness testing, mechanical testing, Thermostream bench for upscreening C.O.T.S. components, tinning, retinning, and BGA reballing, hot solder dip, solderability testing, tin whisker mitigation, and material composition analysis. Tape and reel packaging, PCB design/construction, custom test design, and project management. ADVANCED CIRCUIT ENGINEERS 308 S. Abbott Ave. Milpitas, CA 95035 408.719.1617 sales@advancedcircuitengineers.com advancedcircuitengineers.com Services Offered: Nanoscale engineering FIB circuit edit including specialized frontside and backside modifications for 5 nm architectures and beyond. Metrology and characterization atomic-resolution STEM, probe-corrected imaging providing sub-angstrom validation for advanced materials. Chemical analysis spectroscopy including highsensitivity EELS and EDS for precise elemental quantification and chemical mapping. Precision specimen prep TEM lamella including high-yield, site-specific preparation using advanced dual-beam FIB systems, surface science high-resolution SEM, quantitative surface analysis for morphology, and defect inspection. FA INSTRUMENTS 36217 Worthing Dr. Newark, CA 94560 510.851.5555 info@fainstruments.com fainstruments.com/Service.htm Services Offered: Contract laboratory services and consulting, sample preparation (thinning and end pointing: board, package, and die), microscopy, and analytical skills. IC FAILURE ANALYSIS LAB 3506 W. Lake Center Dr., Suite D Santa Ana, CA 92704 949.329.0340 info@icfailureanalysis.com icfailureanalysis.com Services Offered: One-stop full-house PCB, IC, and reversed engineering FA lab. Tools and Techniques: Level 1: nondestructive optical microscope, scanning acoustic microscopy, x-ray (2D) examination, I-V (curve trace) measurement. Level 2: destructive chemical/laser decapsulation, photo emission microscopy (EMMI/OBIRCH). Level 3: Destructive delayering/parallel lapping, SEM electron microscope services. Other services: counterfeit component authenticity, crosssectioning, energy-dispersive x-ray spectroscopy, FIB precision cutting, secondary ion mass spectrometry, x-ray 3D examination, atomic force microscopy analysis, dye and pry analysis, optical profiler, scanning capacitance microscopy, transmission electron microscopy. INSCOPE LABS PTE. LTD. 11 Ubi Rd. 1, #07-01 Singapore 408723 +65.6779.3735 sales@inscopelabs.com inscopelabs.com Services Offered: Cutting-edge testing, failure analysis, device validation, and materials characterization. Assembly house, electrical analysis, PCB assembly analysis, reliability and environmental testing, reverse engineering, thermal and mechanical analysis, authenticity, and counterfeit detection. Tools and Techniques: X-ray analysis, SEM/EDX analysis, advanced laser emission analysis (TIVA, OBIRCH, LADA, EMMI/PEM using laser, LTP, PEM/EMMI and emission techniques), material characterization, EDX, FTIR, XRF, and sample preparation.
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