edfas.org 39 ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 28 NO. 3 The mobile and computing giant Qualcomm introduced the disruptive “data FA” data-driven analysis concept. While traditional FA typically occurs after product completion or customer returns, Qualcomm advocates for a “shift-left” strategy, integrating the core thinking of FA into the earliest stages of R&D. This transformation from reactive response to active defense is crucial for shortening time-to-market. TSMC provided an in-depth analysis of the practical challenges faced by physical failure analysis engineers. The primary distinction between reliability failure analysis and standard yield analysis lies in addressing components that have passed initial testing but failed subsequently. Furthermore, engineers often work with a unique, single failure sample, leaving zero room for misjudgment. In the face of advanced process complexities, accurately pinpointing defects and tracing them back to production workflows under intense time-to-market pressure remains the key to ensuring product competitiveness. Beyond trend-sharing by industry titans, the workshop invited experts to provide diverse solutions for emerging technologies. Enlitech and SEMICAPS presented forward-looking roadmaps for optical loss localization and wafer-level fault localization for silicon photonics and co-packaged optics (CPO). QuantumDiamonds showcased the revolutionary application of quantum diamond microscopy as a nondestructive inspection tool for current path imaging at the package level. Furthermore, NenoVision shared insights on atomic force microscopy integrated with SEM (AFM-inSEM), while JEOL focused on optimization solutions for passive voltage contrast imaging, leveraging advanced sample preparation techniques to assist engineers in precisely capturing electrical defects within microscopic structures. As a co-organizer of the EDFAS FA Workshop, iST showcased its advanced engineering sample preparation and innovative test interface solutions. While traditional substrate manufacturers prioritize high-volume production, they often struggle to support the low-volume, highmix, and rapid-turnaround requirements of engineering samples. To address this pain point, iST introduced From Lab to Fab: All-in-One Solution. This breakthrough service successfully bridges the market gap by shifting front-end test interface support from the fab stage to the lab stage. It integrates a complete workflow including substrate design, fabrication, die mounting, and the subsequent development of load boards and burn-in boards. This comprehensive service enables customers to complete early verification during EVT/DVT stages, significantly reducing design iteration costs and bridging the final mile to mass production, thereby accelerating time-to-market for global partners. On the second day, the EDFAS FA Workshop moved from the conference hall to iST’s state-of-the-art FA laboratories. This immersive site visit offered global technical experts and attendees a rare opportunity to witness firstline analysis operations, effectively extending the depth of technical discourse from theoretical frameworks to real-world execution environments. The visiting delegates showed significant interest in iST’s advanced analytical capabilities tailored for the high-end semiconductor market, sparking multilayered technical dialogues on practical applications. As chip miniaturization and heterogeneous integration present unprecedented challenges, traditional analytical methods are no longer sufficient. The focus of the discussion centered on leveraging nondestructive, precision techniques to pinpoint nanometer-scale critical lesions without compromising structural integrity—a core challenge shared by both industry and academia. As the laboratory tour concluded, the two-day summit reached its successful finale. This technical summit, held for the first time in Asia, not only proves Taiwan’s core influence in the semiconductor industry but also highlights the synergy of enterprises such as iST, Enlitech, SEMICAPS, NenoVision, and JEOL. By moving in lockstep with top-tier clients like Nvidia, TSMC, and Qualcomm, these companies continue to serve as the most powerful “unseen hands in the post-AI era”—precisely pinpointing fault locations, safeguarding client yields, and collectively ushering in the era of AI and CPO mass production. Contact Rose Ring at jmj4papa@yahoo.com for more details. iST chairman, Danny Yu.
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