edfas.org 13 ELECTRONIC DEV ICE FA I LURE ANALYSIS | VOLUME 23 NO . 4 Adam Waite is a senior cyber scientist in Battelle’s Cyber Trust & Analytics group, having joined the group in 2018. He is currently the imaging and extraction lead for hardware verification and vali- dation in the Air Force Research Laboratory’s Trusted Electronics Branch. Waite has over 15 years of research experience in various materials science disciplines including plasma deposition and in situ diagnostics for thin film growth, nanoscale thermal transport, two-dimensional material nucleation and growth kinetics, device fabrication, as well as verification and validation of integrated circuits. He holds a B.S. in chemical engineering from Tri-State University, an M.S. in materials engineering from the University of Dayton, and a Ph.D. in materials science and engineering from the University of Dayton. John Kelley is a lead cyber scientist in Battelle’s Cyber Trust & Analytics group, having joined in 2019. He is the primary electron microscopist for hardware verification and validation in the Air Force Research Lab’s Trusted Electronics Branch, along with performing image analysis and feature extraction. Kelley has over 15 years of research experience in various areas of chemistry, materials science, andmicroscopy. John holds a B.S. in chemistry andmathematics fromWilmington College, a M.S. in chemistry from Wright State University, and a Ph.D. in materials science and engineering from the University of Dayton. Richard Ott leads the Air Force Verification & Validation efforts in the Trusted Electronics Branch of the Air Force Research Laboratory, Sensors Directorate. In this current role, he actively researches methods for hardware assurance, both destructive and nondestructive in nature. His specialty lies in counterfeit detection and mitigation. He received his B.A. in physics fromOhio Wesleyan University, his M.S. in mechanical engineering from the University of Akron, and his Ph.D. in mechanical engi- neering from Utah State University. Glen“David”Via has beenwith the Aerospace Components andSubsystems Division of the Sensors Directorate at the Air Force Research Laboratory (AFRL) at Wright Patterson Air Force Base inDayton, Ohio for over 30 years. His initial work as a process engineer focused on compound semiconductor device/circuit development. For the past two decades, Via has led numerous independent test and evaluation efforts in support of DARPA technology development programs including: WBGS-RF, NEXT, MPC, NJTT, ICECool, COSMOS, DAHI, and DREaM. Via received his B.S. in electrical engineering fromWright State University in 1992whileworking at AFRL and com- pletedhisM.S. in systems engineering andmanagement science fromtheUniversity of Dayton in 2011.