November_EDFA_Digital

edfas.org ELECTRONIC DEVICE FAILURE ANALYSIS | VOLUME 20 NO. 4 64 Accelerated Analysis...................................................... 64 Allied High Tech................................................. 32-33 / 41 ASM International.......................................................... 44 Checkpoint................................................................ 46-47 Digit Concept. ................................................................ 45 EAG. ................................................................................ 13 Evactron......................................................................... 49 Hamamatsu. .................................................................. 15 ibss Group...................................................................... 59 Instron............................................................................ 51 IR Labs............................................................................ 37 Mentor Graphics............................................................. 41 Quantum Focus Instruments................................... 3 / 57 Quartz Imaging.............................................................. 23 Semicaps........................................................................ 43 TESCAN USA Inc............................................................. 19 ULTRA TEC.................................. Inside front/back covers Zeiss.................................................... Outside back cover For advertising information and rates , contact: Erik Klingerman, National Account Manager; 440.840.9826; Erik.Klingerman@asminternational.org. Current rate card may be viewed online at asminternational.org/mediakit. INDEX OF ADVERTISERS A RESOURCE FOR TECHNICAL INFORMATION AND INDUSTRY DEVELOPMENTS ELECTRONIC DEVICE FAILURE ANALYSIS Visit the Electronic Device Failure Analysis Society website edfas.org GUEST COLUMNIST ABOUT THE AUTHOR After studying technical physics in Munich, Peter Jacob began his professional work in 1981 as a failure analysis expert at the IBM semi- conductor plant in Böblingen, until 1992. After a short period at Hitachi Scientific Instruments, where hewas responsible for electron microscopy configurations and customer training, he joined ETH Zurich/EMPA as a senior expert for failure analysis on micro- andpower-electronics, fromdevice to system level. Parallel to this work, he joined Swatch Group–EM Microelectronic Marin as a principal FA engineer in 1995. Jacob has authored more than 60 contributed and invited papers including two ESREF Best Papers and an ISTFA outstanding poster award. He volunteers in the German ESD Forum, EDFAS, and Eufanet. In 2007, he was appointed as an Honorary Professor of the Technical University of Munich and in 2010 he received the International Barkhausen Award from the Techni- cal University of Dresden. In 2016, he was appointed to head the Swiss Electronics & Reliability Center at EMPA Dübendorf.