November_EDFA_Digital

HIGH RESOLUTION ACOUSTIC GHz MICROSCOPY 4 ADVANCED PACKAGING FAULT ISOLATION CASE STUDIES AND ADVANCEMENT OF EOTPR 24 GEOLOCATION OF Cu WIRES DURING SENSITIVE IC ACID DECAPSULATION 30 EARLY LIFE AUTOMOTIVE ELECTRONICS FAILURES AND THEIR ROOT CAUSES 16 A RESOURCE FOR TECHNICAL INFORMATION AND INDUSTRY DEVELOPMENTS NOVEMBER 2018 | VOLUME 20 | ISSUE 4 edfas.org ELECTRONIC DEVICE FAILURE ANALYSIS 2017 WINNERS PAGE 61 a d e c b